Week in Review: IoT, Security, Autos

By Jeff Dorsch - 09 Aug, 2019 - Comments: 0

Products/Services Synopsys agreed to acquire QTronic, a German company specializing in simulation, test tools, and services for automotive software and systems development. The transaction is expected to close in the fourth quarter of the company’s 2019 fiscal year. “The terms of the deal, which is not material to Synopsys financials, are not being disclosed,” Synopsys said in a statemen... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 26 Apr, 2019 - Comments: 0

Internet of Things Wing received an Air Carrier Certification from the Federal Aviation Administration to begin making commercial deliveries with drones. The Alphabet unit is cleared to deliver packages in southwestern Virginia. Wing has had a pilot program going in the vicinity of Canberra, Australia, and was recently permitted to make commercial deliveries with unmanned aerial vehicles in th... » read more

The Week in Review: IoT

By Jeff Dorsch - 02 Mar, 2018 - Comments: 0

Finance CyberX raised $18 million in Series B funding, bringing its total funding to $30 million. Norwest Venture Partners led the new round and was joined by ff Venture Capital, Flint Capital, Glilot Capital Partners, and OurCrowd. CyberX makes its headquarters in Framingham, Mass., with operations in Israel. The startup offers security protection for Industrial Internet of Things application... » read more

The Week in Review: IoT

By Jeff Dorsch - 20 Oct, 2017 - Comments: 0

Acquisitions ASSA ABLOY has agreed to acquire August Home, a startup providing home security products; the purchase price wasn’t revealed. August Home, which raised $75 million in private funding, should fit well with the Scandinavian conglomerate’s Yale lock business. The transaction is subject to regulatory approval and customary closing conditions; it is expected to close by the end of ... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: August Capital

Week in Review: IoT, Security, Autos

Week in Review: IoT, Security, Auto

The Week in Review: IoT

The Week in Review: IoT

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