Ethernet: The Highway For Automotive Electronics?

By Joanne Itow - 19 Jun, 2014 - Comments: 0

What happens when technology from the fast paced communication industry makes a move into the traditional automotive industry? Semiconductor marketers and even the automotive industry are talking about revolutionary changes inside and outside the vehicle. What kinds of changes? Ethernet and sensors. There’s a lot of excitement and enthusiasm over the prospect of cars with Ethernet networki... » read more

The New Face Of MCUs

By Ann Mutschler - 10 Apr, 2014 - Comments: 0

For years, the humble microcontroller was known as the workhorse of white goods and other embedded applications that required some amount of processing, but not as much as a microprocessor would provide. Much has changed since then. Today’s MCUs are the star components in fast-growing and increasingly sophisticated application areas such as automotive, smartphones and the Internet of Thing... » read more

Experts At The Table: Automotive Electronics

By Ann Mutschler - 09 Aug, 2013 - Comments: 0

By Ann Steffora Mutschler System-Level Design sat down to discuss the opportunities in automotive electronics with Alexandre Palus, principal SoC architect at Altera; Aveek Sarkar, VP of product engineering & support at Apache; Mladen Nizic, engineering director, mixed signal solution at Cadence; and Stephen Pateras, product marketing director, silicon test solutions at Mentor Graphics. W... » read more

Experts At The Table: Automotive Electronics

By Ann Mutschler - 02 Aug, 2013 - Comments: 0

Experts At The Table: Automotive Electronics

By Ann Mutschler - 25 Jul, 2013 - Comments: 0

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: automotive electronics

Ethernet: The Highway For Automotive Electronics?

The New Face Of MCUs

Experts At The Table: Automotive Electronics

Experts At The Table: Automotive Electronics

Experts At The Table: Automotive Electronics