Chip Industry Week In Review


Global chips sales hit a record $56.9 billion in October, a 22% increase versus October 2023, according to the Semiconductor Industry Association. Also, global semiconductor equipment billings reached $30.38 billion in Q3 2024, a 19% YoY increase and 13% growth QoQ, SEMI reported. TSMC commenced equipment installation for its 2nm fab in Kaohsiung, Taiwan, six months ahead of schedule. The 2n... » read more

Shift Left Is The Tip Of The Iceberg


Shift left is evolving from a buzzword into a much broader shift in design methodology and EDA tooling, and while it's still early innings there is widespread agreement that it will be transformative. The semiconductor industry has gone through many changes over the past few decades. Some are obvious, but others happen because of a convergence of multiple factors that require systemic change... » read more

Chip Industry Week In Review


Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor's planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS). President Biden signed into law a bill that exempts some semiconductor projects funded by the U.S.... » read more

Chip Industry Week in Review


The Biden-Harris Administration announced preliminary terms with HP for $50 million in direct funding under the CHIPs and Science Act to support the expansion and modernization of HP’s existing microfluidics and microelectromechanical systems (“MEMS”) facility in Corvallis, Oregon. CHIPS for America launched the CHIPS Metrology Community, a collaborative initiative designed to advance ... » read more

Chip Industry Week In Review


The U.S. Department of Commerce issued a notice of intent  to fund new R&D activities to establish and accelerate domestic advanced packaging capacity. CHIPS for America expects to award up to $1.6 billion in funding innovation across five R&D areas, as outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP), with about $150 million per award in each... » read more

Chip Industry Week In Review


President Biden will raise the tariff rate on Chinese semiconductors from 25% to 50% by 2025, among other measures to protect U.S. businesses from China’s trade practices. Also, as part of President Biden’s AI Executive Order, the Administration released steps to protect workers from AI risks, including human oversight of systems and transparency about what systems are being used. Intel ... » read more

Private Delegated Computations Using Strong Isolation


Computations are now routinely delegated to third-parties. In response, Confidential Computing technologies are being added to microprocessors offering a trusted execution environment (TEE) that provides confidentiality and integrity guarantees to code and data hosted within—even in the face of a privileged attacker. TEEs, along with an attestation protocol, permit remote third-parties to est... » read more

Chip Industry Week In Review


By Jesse Allen, Linda Christensen, and Liz Allan.  The Biden administration plans to invest more than $5B  for semiconductor R&D and workforce support, including in the National Semiconductor Technology Center (NSTC), as part of the rollout of the CHIPS Act. Today's announcement included at least hundreds of millions for the NSTC workforce efforts, including creating a Workforce Cente... » read more

Chip Industry Week In Review


By Jesse Allen, Karen Heyman, and Liz Allan Renesas will acquire Transphorm, which designs and manufactures gallium nitride power devices, for about $339 million. GaN, which is a wide-bandgap technology, is used for high-voltage applications in a slew of markets, including EVs and EV fast chargers, as well as data centers and industrial applications. Cadence acquired Invecas, a provider o... » read more

Using Keysight Design Data Management SOS In The Cloud


Integrated circuits (ICs) are becoming increasingly complex and resource intensive. This is challenging companies to design chips more efficiently and reduce the overall impact of peak processing loads. Companies typically use large server farms and high-performance storage systems to design and validate chips quickly and efficiently. However, this approach is very resource intensive. For ex... » read more

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