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Startup Funding: Q1 2025

By Jesse Allen - 02 Apr, 2025 - Comments: 0

The first quarter of 2025 saw six companies raise at least $100 million in investment. Of those, three went to quantum hardware companies, with major investment into neutral atom, superconducting, and hybrid quantum control approaches. AI chips and enabling technology were another big winner in the quarter, with companies developing optical communications tech for chips and data center infra... » read more

Week In Review: Design, Low Power

By Jesse Allen - 26 Oct, 2018 - Comments: 0

Tools OneSpin launched a formal verification tool that integrates with all major simulators, coverage databases and viewers, and chip design verification planning tools to provide a comprehensive view of verification progress. Comprised of two new formal apps, it can identify unreachable coverage points and provide them to the simulator to reduce wasted effort. Synopsys released the latest ... » read more

Trending Articles

Startup Funding: Q1 2025

AI chips and data center communications see big funding; 75 startups raise $2 billion.

Advanced Packaging Fundamentals for Semiconductor Engineers

New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.

Chip Industry Week In Review

Tariff questions, impact; global sales report; Europe's chiplets focus; DARPA's quantum push; Intel 18A enters risk production; optical networking bonanza; new wafer probe test; inference benchmark results; UMC opens 22nm fab in Singapore.

by The SE Staff

Chiplet Tradeoffs And Limitations

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on power, performance, and cost.

by Ann Mutschler

2030 Data Center AI Chip Winners: The Trillion Dollar Club

Data center will be >50% of semis; CSPs/OpenAI, Nvidia, TSMC, Broadcom are best positioned

Knowledge Centers
Entities, people and technologies explored

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Startup Funding: Q4 2024

AI chips and interconnects end year on high note; $3 billion for 75 companies.

by Jesse Allen

Impact of Extremely Low Temperatures On The 5nm SRAM Array Size and Performance

by Technical Paper Link

Linear Pluggable Optics Save Energy In Data Centers

New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.

by Bryon Moyer

Chip Architectures Becoming Much More Complex With Chiplets

Options for how to build systems increase, but so do integration issues.

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What’s Next For Through-Silicon Vias

Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in 3D packaging.

by Laura Peters

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