What’s In Your IP?

By Ed Sperling - 21 Feb, 2020 - Comments: 0

Jeff Markham, software architect at ClioSoft, talks with Semiconductor Engineering about IP traceability in markets such as automotive and aerospace, what’s actually in IP, what should not be in that IP from a security standpoint, and how all of this data can used to avert system reliability issues in the future. » read more

Digital Twins Deciphered

By Brian Bailey - 28 Mar, 2019 - Comments: 0

Ever since Siemens acquired Mentor Graphics in 2016, a new phrase has become more common in the semiconductor industry – the digital twin. Exactly what that is, and what impact it will have on the semiconductor industry, is less clear. In fact, many in the industry are scratching their heads over the term. The initial reaction is that the industry has been creating what are now termed digi... » read more

Industrial Electronics Gain Greater Manufacturing Flexibility With Embedded Memory

By Lee Sun - 03 Mar, 2016 - Comments: 0

While IoT continues to capture the semiconductor industry’s collective imagination, not to be overlooked is the industrial electronics market. Just consider the wide swath industrial electronics cuts. It could be anything related to electrical equipment in an industrial setting, and includes everything from control systems, instrumentation, mechanicals and diagnostics to signal processing and... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: bill of materials

What’s In Your IP?

Digital Twins Deciphered

Industrial Electronics Gain Greater Manufacturing Flexibility With Embedded Memory