Week In Review: Manufacturing, Test

By Karen Heyman - 19 Aug, 2022 - Comments: 0

The U.S. Commerce Department issued export controls on key technologies, including gallium oxide (Ga2O3) and diamond substrates, which are used at high voltages and temperatures, as well as EDA tools specifically developed for GAA FETs. It's not clear how this will impact EDA companies, because many of the tools that will be used for designing for GAA FETs already are in use today for finFETs. ... » read more

Startup Funding: May 2022

By Jesse Allen - 06 Jun, 2022 - Comments: 0

May was another strong month for China as it continues its push to build a native semiconductor ecosystem. Over half the month's total funding went to startups in the country. Over half the companies funded were from China as well, including two FPGA companies, three making CPUs, a GPU startup, and numerous networking and wireless chip companies. Two of those, in FPGAs and CPUs, raised rounds s... » read more

Startup Funding: November 2021

By Jesse Allen - 01 Dec, 2021 - Comments: 0

There's nothing virtual about the level of interest in AR/VR startups. As the concept of the 'metaverse' becomes more widespread with Nvidia's recent GTC announcements and Facebook's rebranding, investors poured money into startups with enabling technology for augmented, virtual, and extended reality. Most of those are developing waveguides and other display technology that is light enough to b... » read more

Startup Funding: June 2020

By Jesse Allen - 08 Jul, 2020 - Comments: 0

Two Chinese startups drew big investment as the country aims to become more semiconductor independent as trade restrictions continue. One company deals in wafers, packaging, and IC design, while the other is focused on AI chips. Quantum computing startups didn't see large investments this month, as most are still very young companies, but the number of them grew with a new university spin-out e... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Biren Technology

Week In Review: Manufacturing, Test

Startup Funding: May 2022

Startup Funding: November 2021

Startup Funding: June 2020