Baby Steps Toward 3D DRAM
Stacking layers means a complete architecture rethink.
Chip Industry Week In Review
California SiC factory funding; IEDM announcements, including 2nm and 2D materials advances from Intel and TSMC, CFETs, and subtractive ruthenium metallization; Rapidus' new partnerships; Synopsys' 1.6 Tbps Ethernet IP; Micron's $6.1B DRAM fab grant; global IC sales set record; Lam's maintenance cobot; China ramps U.S. imports ahead of tariffs.
What’s Next For Through-Silicon Vias
Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in 3D packaging.
Chip Industry Week in Review
Next-gen EUV laser R&D; $285M CHIPS Act award; U.S. microelectronics research centers; Synaptics-Google deal; maskless microLED DUV; Micron's $2B fab expansion; Tesla sales slump; USB-C mandate in Europe.
Strain, Stress In Advanced Packages Drives New Design Approaches
Heterogenous integration is pushing chip and package designers to consider multi-physics effects as early as the initial architectural planning stage; new tools may be needed.
Shift Left Is The Tip Of The Iceberg
A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.
Partitioning In The Chiplet Era
Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.
NAND Flash Targets 1,000 Layers
New techniques go beyond improved deposition and etching, but challenges stack up, too.
What Comes After HBM For Chiplets
The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?
Memory Fundamentals For Engineers
eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.
Testing For Thermal Issues Becomes More Difficult
Chiplets, exotic materials, and heterogeneous integration are impacting test coverage.
Auto Chip Aging Accelerates In Hot Climates
New data shows significant reduction in lifespan and potential new security issues as global temperatures rise.
GDDR7 Memory Supercharges AI Inference
High bandwidth and low latency are paramount for AI-powered edge and endpoints.
