tag: BRIDG

Week In Review: Manufacturing, Test
By Karen Heyman - 28 Jul, 2023 - Comments: 0

The Chinese government is considering easing proposed rules that require foreign office equipment makers operating in the country to transfer key product technology to China, per Nikkei Asia. In April 2022, Chinese authorities began revamping their national standards to include a new requirement that key components, such as semiconductors and laser-related items, be designed, developed, and pro... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 04 Nov, 2022 - Comments: 0

Nikkei Asia reports the U.S. is urging allies, including Japan, to restrict exports of advanced semiconductors and related technology to China. The U.S. holds 12% of the global semiconductor market, Japan has a 15% share, while Taiwan and South Korea each have about a 20% share. Some U.S. companies have called for other countries to adopt U.S.-style export curbs, arguing it is unfair for only A... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 29 Jan, 2021 - Comments: 0

Packaging and test Intel has invested an additional $475 million in its chip assembly and test manufacturing facility in the Saigon Hi-Tech Park (SHTP) in Vietnam. This takes Intel’s total investment in the Vietnam facility to $1.5 billion. The site assembles and tests Intel’s 5G products and processors. TSMC recently announced a huge increase in capital spending for 2021. A large perce... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 06 Dec, 2019 - Comments: 0

Chipmakers United Microelectronics Corp. (UMC) has announced the readiness of its new 22nm process. The process enables new 22nm designs or allows customers to migrate from 28nm to 22nm. UMC’s 22nm maintains its existing 28nm design architectures. UMC's 22nm process features a 10% area reduction, better power-to-performance ratio and enhanced RF capabilities, compared to the company’s 2... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Jul, 2019 - Comments: 0

Semi takeover targets Semiconductor M&A activity is heating up again. So who is next? “Within our coverage universe, we believe AMBA (Ambarella) and SLAB (Silicon Labs) represent the most likely targets moving forward,” according to KeyBanc in a research note. KeyBanc also listed some other “M&A Combinations That Could Make Sense.” Some of these combos make sense, while othe... » read more

Manufacturing Bits: July 31
By Mark LaPedus - 31 Jul, 2018 - Comments: 0

Florida R&D fab A new microelectronics R&D initiative in Florida is expanding its operations and readying its new 200mm fab facility. The initiative, called BRIDG, describes itself as a non-profit, public-private partnership. BRIDG is basically an R&D microelectronics facility, which is focusing on the development of select technologies, such as photonics, sensors, imagers and 2.5D/3D pac... » read more

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