tag: Broadcom

Chip Industry Week In Review
By The SE Staff - 31 Jan, 2025 - Comments: 0

Chinese startup DeepSeek rattled the tech world and U.S. stock market with claims it spent just $5.6 million on compute power for its AI model compared to its billion-dollar rivals in the U.S. The announcement raised questions about U.S. investment strategies in AI infrastructure and led to an initial $600 billion selloff of NVIDIA stock. Since its launch, DeepSeek reportedly was hit by malicio... » read more

Fast Monte Carlo Simulations For Timing Variation Analysis
By Vinod Khera - 30 Jan, 2025 - Comments: 0

Process variations and device mismatches profoundly affect the latest ultra-small geometrical processes. Complexity creates additional factors that impact device manufacturing variability, which in turn impact overall yield. Monte Carlo (MC) simulations use repeated random sampling to relate process variations to circuit performance and functionality, thus determining how they impact yield. How... » read more

Chip Industry Week In Review
By The SE Staff - 13 Dec, 2024 - Comments: 0

The 2024 IEEE International Electron Devices Meeting (IEDM) was held this week, prompting a number of announcements from: imec: Proposed a new CFET-based standard cell architecture for the A7 node containing two rows of CFETs with a shared signal routing wall in between, allowing standard cell heights to be reduced from 4 to 3.5T, compared to single-row CFETs. Integrated indium pho... » read more

Data Center Thermal Management Improves
By Karen Heyman - 18 Jul, 2024 - Comments: 0

Thermal issues are plaguing semiconductor design at every level, from chips developed with single-digit nanometer processes to 100,000-square-foot data centers. The underlying cause is too many devices or services that require increasing amounts of power, and too few opportunities for the resulting heat to dissipate. “Everybody wants to try to do more in a small volume of space,” said St... » read more

Chip Industry Week In Review
By The SE Staff - 28 Jun, 2024 - Comments: 0

The Design Automation Conference morphed into the Chips to Systems Conference, reflecting an industry shift from monolithic SoCs to assemblies of chiplets in various flavors of advanced packaging. The change drew a slew of students and a resurgent buzz, fueled by discussions about heterogeneous integration, reliability, and ways to leverage AI/ML to speed up design and verification processes. ... » read more

Chip Industry Week In Review
By The SE Staff - 31 May, 2024 - Comments: 0

JEDEC and the Open Compute Project rolled out a new set of guidelines for standardizing chiplet characterization details, such as thermal properties, physical and mechanical requirements, and behavior specs. Those details have been a sticking point for commercial chiplets, because without them it's not possible to choose the best chiplet for a particular application or workload. The guidelines ... » read more

Linear Drive Optics May Reduce Data Latency
By Karen Heyman - 11 Apr, 2024 - Comments: 0

Optical and electrical are starting to cross paths at a much deeper level, particularly with the growing focus on 3D-ICs and AI/ML training in data centers, driving changes both in how chips are designed and how these very different technologies are integrated together. At the root of this shift are the power and performance demands of AI/ML. It can now take several buildings of a data cente... » read more

Silicon Photonics Manufacturing Ramps Up
By Gregory Haley - 21 Mar, 2024 - Comments: 0

Circuit scaling is starting to hit a wall as the laws of physics clash with exponential increases in the volume of data, forcing chipmakers to take a much closer look at silicon photonics as a way of moving data from where it is collected to where it is processed and stored. The laws of physics are immutable. Put simply, there are limits to how fast an electron can travel through copper. The... » read more

Why Chiplets Are So Critical In Automotive
By John Koon - 20 Feb, 2024 - Comments: 1

Chiplets are gaining renewed attention in the automotive market, where increasing electrification and intense competition are forcing companies to accelerate their design and production schedules. Electrification has lit a fire under some of the biggest and best-known carmakers, which are struggling to remain competitive in the face of very short market windows and constantly changing requir... » read more

Money Pours Into New Fabs And Facilities
By Liz Allan - 03 Jan, 2024 - Comments: 0

Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil. Looking ahead, artificial intelligence (AI), quantum computing, and data applications... » read more

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