The Week In Review: IoT

By Jeff Dorsch - 10 Mar, 2017 - Comments: 0

Products NASA this week deployed its latest Technology Educational Satellite, TechEdSat-5, from the International Space Station. The satellite, said to be about the size of a fire extinguisher, will provide wireless data communications for ISS payloads and other satellites. TechEdSat-5 has Digi XBee 802.15.4 modules from Digi International to use in the test program. Flexpoint Sensor System... » read more

The Week In Review: IoT

By Jeff Dorsch - 03 Feb, 2017 - Comments: 0

Finance NXP Semiconductors reported its Secure Connected Devices group posted revenue of $569 million in the fourth quarter, a gain of 10% from a year earlier. NXP CEO Richard Clemmer said in a statement, “All major product lines contributed to a seasonally solid quarter.” The chip company reported Q4 revenue of $2.44 billion and 2016 revenue of nearly $9.5 billion. Consortia Bosch, C... » read more

The Week In Review: IoT

By Jeff Dorsch - 09 Sep, 2016 - Comments: 0

Analysis After reading a blog post touting the Internet of Things for home security, Jon Hedren wrote this post detailing how IoT-based home systems can be easily compromised and could fail in multiple ways. “The IoT ‘dream’ as sold by the industry is pretty cool, but it’s still just a dream. For now, these devices remain generally shoddy, insecure, and easily breakable—and must be t... » read more

Intelligent Autonomous IoT

By Brian Derrick - 03 Dec, 2015 - Comments: 0

Last month I discussed what new markets and winners IoT would produce. Sensors and devices, the edge, server chips and the cloud, are obvious winners. However, it’s not so clear who the winner is in the middle, the realm of gateways and embedded software. These technologies are critical to connecting existing infrastructure to the world of IoT and enabling a whole new category of IoT solution... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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The Week In Review: IoT

The Week In Review: IoT

The Week In Review: IoT

Intelligent Autonomous IoT