tag: Capital TEN

Startup Funding: Q1 2025

By Jesse Allen - 02 Apr, 2025 - Comments: 0

The first quarter of 2025 saw six companies raise at least $100 million in investment. Of those, three went to quantum hardware companies, with major investment into neutral atom, superconducting, and hybrid quantum control approaches. AI chips and enabling technology were another big winner in the quarter, with companies developing optical communications tech for chips and data center infra... » read more

Startup Funding: Q2 2024

By Jesse Allen - 10 Jul, 2024 - Comments: 0

AI drew more investors to the chip industry in Q2. Four AI-focused chip startups receiving rounds of more than $100 million, targeting data center ASICs for transformers, highly flexible platforms for the embedded edge, dataflow processors, and mixed-signal neuromorphic chips. In-memory computing also helped boost AI, with three companies either incorporating it into their chips or providing sp... » read more

Startup Funding: May 2023

By Jesse Allen - 07 Jun, 2023 - Comments: 0

Photonic interconnects were an area of activity in May, with two companies raising funds for what could be much faster chip-to-chip and chiplet-to-chiplet links. Microstructured optics and metasurfaces also drew investment, with four companies creating products for a range of applications from flexible LEDs to multi-wavelength spectral imaging. The large language models that power many gener... » read more

Trending Articles

What Exactly Are Chiplets And Heterogeneous Integration?

New technologies drive new terminology, but the early days for those new approaches can be very confusing.

Startup Funding: Q1 2025

AI chips and data center communications see big funding; 75 startups raise $2 billion.

Chip Industry Week In Review

Agentic AI chip design; $6.5B AI acquisition; IC energy consumption and emissions; US allies export controls; CPO switches; foundry and IC design house revenue reports; side-channel analysis library; 12-layer HBM4; 3D GAA utilizing 2D semis; EV charging in 5 minutes.

by The SE Staff

Big Changes Ahead For Interposers And Substrates

New materials and processes will help with power distribution and thermal dissipation in advanced packages.

by Gregory Haley

Chip Industry Week In Review

Tariff questions, impact; global sales report; Europe's chiplets focus; DARPA's quantum push; Intel 18A enters risk production; optical networking bonanza; new wafer probe test; inference benchmark results; UMC opens 22nm fab in Singapore.

by The SE Staff

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Startup Funding: Q4 2024

AI chips and interconnects end year on high note; $3 billion for 75 companies.

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Chip Architectures Becoming Much More Complex With Chiplets

Options for how to build systems increase, but so do integration issues.

by Ed Sperling and Ann Mutschler

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