XENSIV PAS CO2

By Infineon - 05 Apr, 2023 - Comments: 0

This white paper demonstrates how Infineon’s new CO2 sensor XENSIVTM PAS CO2, based on photo-acoustic spectroscopy (PAS) technology, is compatible with the sensor requirement defined by the WELL Building Standard and the LEED rating system. The evidence presented is based on conceptual and experimental data. The document also provides a detailed analysis of the contribution of the sen... » read more

Indoor Gas Sensors Proliferate With Better Standards

By Susan Rambo - 01 Dec, 2022 - Comments: 0

The gas sensor market is rapidly expanding, driven by increased concerns about indoor air quality and better technology for detecting and measuring it. Indoor air quality sensing targets gases and concentrations that differ — with some overlap — from outside. But until the pandemic, which largely coincided with a flood of new research about what is toxic to people and animals, this has b... » read more

Meeting Stringent CO2 Building Code Requirements

By Infineon - 02 Mar, 2022 - Comments: 0

As today’s world is struggling to come to grips with a worldwide pandemic and the rapid spread of viruses, accurate and reliable indoor air quality monitoring has become a crucial part of existing and newly updated building codes. This white paper discusses carbon dioxide (CO2) monitoring requirements as covered by California’s Title 24 standard (one of the strictest building code standards... » read more

More Than Just Carbon Dioxide

By Katherine Derbyshire - 14 Dec, 2016 - Comments: 0

As discussed in Part Two of this series, lifecycle analyses of greenhouse gas emissions consider both direct and indirect sources. Indirect CO2 emissions, attributed to electricity and other forms of energy purchased by the fab, are the semiconductor industry’s single largest environmental impact. Of those emissions, a large fraction are attributable to plasma-based etch and deposition steps,... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: carbon dioxide

XENSIV PAS CO2

Indoor Gas Sensors Proliferate With Better Standards

Meeting Stringent CO2 Building Code Requirements

More Than Just Carbon Dioxide