A Performance Analysis Of The First Generation Of HPC‐Optimized Arm Processors


In this paper, the authors present performance results from Isambard, the first production supercomputer to be based on Arm CPUs that have been optimized specifically for HPC. Isambard is the first Cray XC50 “Scout” system, combining Cavium ThunderX2 Arm‐based CPUs with Cray's Aries interconnect. The full Isambard system contained over 10,000 Arm cores. In this work, we present node‐lev... » read more

Isambard Analysis of HPC-Optimized Arm Processors


Written by Simon McIntosh‐Smith, James Price, Tom Deakin, Andrei Poenaru (all from the High Performance Computing Research Group, Department of Computer Science, University of Bristol, Bristol, UK) In this paper, we present performance results from Isambard, the first production supercomputer to be based on Arm CPUs that have been optimized specifically for HPC. Isambard is the first Cray ... » read more

Week in Review: IoT, Security, Auto


Internet of Things DHL Supply Chain reports that it will spend $300 million to install Internet of Things sensors and collaborative robots in its North American warehouses, bringing 60% of those facilities up to automation capabilities already implemented in 85 of DHL’s 430 warehouses in North America. The company will also employ robotic process automation software and other programs to red... » read more

Week in Review: IoT, Security, Auto


Deals Dialog Semiconductor made a blockbuster deal with Apple – the chip company will license power management technologies and transfer some assets to Apple, which will use them in their internal chip research and development. More than 300 Dialog employees, mostly engineers, will join Apple, which will pay $300 million in cash for the transaction and prepay another $300 million for Dialog ... » read more

Bugs That Kill


Are simulation-resistant superbugs stifling innovation? That is a question Craig Shirley, president and CEO of Oski Technology, asked a collection of semiconductor executives over dinner. Semiconductor Engineering was invited to hear that discussion and to present the key points of the discussion. To promote free conversation, the participants, who are listed below, asked not to be quoted di... » read more

Week in Review: IoT, Security, Auto


Deals SoftBank Corp. reached an agreement with Indonesia’s Link Net to work together on Internet of Things technology. Hidebumi Kitahara of SoftBank said in a statement, “The global mobile industry is now entering the 5G era, with IoT becoming the central focal point of innovation. This partnership with Link Net shows our strong commitment to further boost technology innovation in the glob... » read more

The Darker Side Of Consolidation


Another wave of consolidation is underway in the semiconductor industry, setting the stage for some high-stakes competitive battles over market turf and sowing confusion across the supply chain about continued support throughout a product's projected lifetime. The consolidation comes as chipmakers already are grappling with rising complexity, the loss of a roadmap for future designs as Moore... » read more

Week in Review: IoT, Auto, Security


Executive Changes Rambus' board of directors named Luc Seraphin, senior vice president and general manager of the company's Memory and Interfaces Division, as interim CEO while it searches for a replacement for Ron Black. The board terminated Black this week, saying the reason for termination did not involve Rambus' financial and business performance. The company also named Mike Noonen as se... » read more

The Week in Review: IoT


Finance Marvell Technology Group priced $500 million in senior notes due in 2023 and $500 million in senior notes due in 2028. The chip company will use net proceeds from the debt offering, cash on hand, and borrowings under a new term loan facility to fund the cash consideration and other amounts payable for Marvell’s proposed $6 billion acquisition of Cavium. The companies have expected to... » read more

The Week in Review: IoT


Finance Orbbec of Shenzhen, China, a developer of motion sensing technology, raised more than $200 million in Series D funding led by Ant Financial. Also participating in the new round were SAIF Financial, Green Pine Capital Partners, R-Z Capital, and Tianlangxing Capital Partners. Established in 2013, Orbbec develops 3D sensors for applications in facial recognition, gesture recognition, robo... » read more

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