Chip Industry Week In Review


Intel said its new fab in Licking County, Ohio will be delayed due to financial struggles and a need to align chip production with market demand, reported the Columbus Dispatch. Construction is now estimated to be completed in 2030, with operations to start in 2030 or 2031. The company said it already has invested $3.7 billion locally. Apple plans to invest more than $500 billion in the U.S... » read more

Chip Industry Week In Review


The EU Commission approved €920 million in German State aid to support Infineon in setting up its Smart Power Fab in Dresden. Total funding for the Dresden site amounts to about €1 billion. PDF Solutions will acquire secureWISE for $130 million to expand the reach of its semiconductor manufacturing data platform, providing secure, remote access monitoring and control. Tariffs, trade, and ... » read more

Chip Industry Week In Review


Chinese startup DeepSeek rattled the tech world and U.S. stock market with claims it spent just $5.6 million on compute power for its AI model compared to its billion-dollar rivals in the U.S. The announcement raised questions about U.S. investment strategies in AI infrastructure and led to an initial $600 billion selloff of NVIDIA stock. Since its launch, DeepSeek reportedly was hit by malicio... » read more

Global IC Fabs And Facilities Report: 2024


The chip industry made significant capital investments this year to build new fabs and facilities or expand existing premises. A number of sites were dedicated to SiC, GaN, DRAM, HBM, along with packaging and assembly by OSATs, and essential gases, chemicals, and other components. More than a dozen R&D centers were also established for 8-inch wafers, EUV, and advanced packaging. Investments... » read more

EU Chips Act: A Game Changer For The Digital Economy


The global semiconductor landscape has undergone significant transformation in recent years. With disruptions such as the semiconductor supply chain crisis and the challenges it posed to the automotive sector, Europe’s dependence on external fabrication facilities, particularly in Taiwan, has become a pressing concern. In response, the European Union (EU) introduced the EU Chips Act, a compre... » read more

Chip Industry Week In Review


The 2024 IEEE International Electron Devices Meeting (IEDM) was held this week, prompting a number of announcements from: imec: Proposed a new CFET-based standard cell architecture for the A7 node containing two rows of CFETs with a shared signal routing wall in between, allowing standard cell heights to be reduced from 4 to 3.5T, compared to single-row CFETs. Integrated indium pho... » read more

Chip Industry Week In Review


Intel CEO Pat Gelsinger retired on Dec. 1, according to the company. He will be replaced by two interim co-CEOs, David Zinsner, who also continues to serve as CFO  and Michelle Johnston Holthaus, who has been named CEO of Intel Products. In addition, Frank Yeary was named interim executive chairman. Intel has been under pressure investors as non-traditional rivals, including Arm and NVIDIA, co... » read more

Chip Industry Technical Paper Roundup: Nov. 5


New technical papers recently added to Semiconductor Engineering’s library: [table id=378 /]   Further Reading Chip Industry Week In Review Silicon Valley design center and NY EUV Accelerator; Siemens’ big acquisition; Onto extends panel inspection with two acquisitions; DENSO-Quadric deal; thinner Si-based power wafer; $100M funding for AI; trade wars escalate; earnings rep... » read more

EMEA Investments Driving Technology Specialization


Government programs across Europe and the UK are seeing a surge of investments in leading edge technology, materials, and packaging. Industry and academia are coalescing around specialty areas, drawing on established relationships to foster innovation and fill gaps in regional supply chains while also maintaining international bonds. Government initiatives also are picking up in Israel, Saudi A... » read more

2D Semiconductors Make Progress, But So Does Silicon


Semiconductor industry researchers have been anticipating the need for better transistor channel materials to replace silicon for a long time, but silicon devices have continued to improve enough to postpone that change. Silicon continues to provide an unmatched combination of device performance, manufacturability, and cost effectiveness. In recent years, though, the “end of silicon” cha... » read more

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