SRAM In AI: The Future Of Memory
Why SRAM is viewed as a critical element in new and traditional compute architectures.
Flipping Processor Design On Its Head
AI workloads are changing processor design in some unexpected ways.
Big Shifts In Power Electronics Packaging
Packages are becoming more complex to endure high power, high temperature conditions across a variety of applications.
Chip Industry Week In Review
$3B for packaging program; DARPA's 3DHI; AI yield improvement tool; OpenAI CEO reinstated; EV consumer sentiment; SiC market projections; RISC-V security model; AI edge devices; ESD discharge; ML in failure analysis.
Chip Industry Week In Review
German chipmakers cleared to stake in TSMC foundry; Synopsys makes big bet on RISC-V; Keysight takes 50.6% share in ESI; self-assembling nanosheets; cheap EVs; Teradyne's JV with Technoprobe; auto chiplets; new approach to mitigating rowhammer.
RISC-V Wants All Your Cores
It is not enough to want to dominate the world of CPUs. RISC-V has every core in its sights, and it's starting to take steps to get there.
SRAM In AI: The Future Of Memory
Why SRAM is viewed as a critical element in new and traditional compute architectures.
Power Semis Usher In The Silicon Carbide Era
Price parity with silicon modules, increased demand in EVs, and more capacity are driving widespread adoption.
Why Chiplets Don’t Work For All Designs
Getting this wrong can increase power and cost, while reducing performance.
Building Better Bridges In Advanced Packaging
Leading-edge applications, from biotech to co-packaged optics, require choices in architectures, assembly methods, and materials for system performance.
ReRAM Seeks To Replace NOR
There is increased interest in ReRAM for embedded computing, especially in automotive applications, as more of its known issues are solved. Nevertheless, there is no one-size-fits-all NVM.
MRAM Getting More Attention At Smallest Nodes
Why this 25-year-old technology may be the memory of choice for leading edge designs and in automotive applications.
Sweeping Changes For Leading-Edge Chip Architectures
Large language models and huge data volumes are prompting innovation at every level.
