Startup Funding: April 2023

By Jesse Allen - 03 May, 2023 - Comments: 0

Packaging was a hot spot in April, with one of the largest rounds going to a middle-end-of-line advanced packaging company. A second packaging company also drew significant funding for its focus on wafer-level packaging for CMOS image sensors. Two packaging substrate manufacturers also saw investment. Two photoresist makers also drew sizeable rounds. Both they and the packaging companies are... » read more

Startup Funding: November 2022

By Jesse Allen - 07 Dec, 2022 - Comments: 0

November was a month for mega-rounds, with ten companies receiving investments of at least $100 million. One of those is a startup providing connectivity solutions for data centers and enabling use of the memory pooling functionality in the latest update to the CXL standard. Two quantum computer startups were part of the $100M+ club this month — one using very cold atoms to take on not only q... » read more

Startup Funding: October 2022

By Jesse Allen - 02 Nov, 2022 - Comments: 1

Investors poured $3.5 billion into 113 startup companies in October 2022, especially new battery technology, AI hardware, and faster memory access. Battery technology dominated the fundraising in October thanks to the U.S. Department of Energy and four funding rounds that exceeded $200M. The DOE awarded sizeable grants to help 20 companies, including six startups, build out battery material ... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

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by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

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tag: China Fortune-Innovation Capital

Startup Funding: April 2023

Startup Funding: November 2022

Startup Funding: October 2022

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