tag: chip-package-system co-design

7nm Design Success Necessitates A Multi-Physics Approach

By Youngsoo Lee - 12 Jan, 2017 - Comments: 0

Whether you are designing an energy efficient mobile device, or an ADAS platform with stringent reliability requirements, or a high performance enterprise networking system, chips fabricated on advanced technologies such as 7-nanometer (nm) process and 2.5/3D or wafer level packaging can provide several advantages. Designs using these technologies consume less power while delivering higher thro... » read more

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