tag: chip-package thermal analysis

Tech Talk: 7nm Power

By Ed Sperling - 19 Jun, 2017 - Comments: 0

Annapoorna Krishnaswamy, lead applications engineer at ANSYS, talks with Semiconductor Engineering about power-related changes at 7nm and what engineering teams need to watch out for as they move down to the latest process technology. https://youtu.be/Ym46ssJPeHM » read more

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