Startup Funding: September 2021

By Jesse Allen - 04 Oct, 2021 - Comments: 0

Startups focused on data center chips had a big month in September. A new emergent from stealth promises to accelerate big data analytics, and startups proving CXL connectivity and high-performance RISC-V chiplets also drew funding. On the other end of the spectrum, NB-IoT and edge AI designers saw investment while a company providing on-chip monitoring can predict when chips will fail. Plus, c... » read more

Startup Funding: July 2021

By Jesse Allen - 04 Aug, 2021 - Comments: 0

The trend of big funding for Chinese autonomous driving companies continued in July, with three startups each drawing $100M or more for efforts in ADAS and computer vision for automotive. The month also saw one electric vehicle manufacturer get a massive boost as it begins production on its first models, while significant funding also went to a company that wants to recycle used up EV batteries... » read more

Startup Funding: January 2021

By Jesse Allen - 03 Feb, 2021 - Comments: 0

Over $800M in funding went to companies developing autonomous driving technology, from self-driving-focused AI chips to full vehicles and aftermarket solutions. A couple electric vehicle manufacturers stood out this month, with investors putting large backing behind US-based Rivian and China-based Leapmotor. And with EVs come lots of batteries: funding went to a few startups trying out new batt... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 31 Aug, 2018 - Comments: 1

Internet of Things Electrolux, Haier, LG Electronics, and Samsung Electronics announced they are working with the Open Connectivity Foundation, an Internet of Things standards body, to build, commercialize, and deploy interoperable OCF-Certified connected products during 2019. In addition, the OCF is launching an enhanced security model and secure cloud management capabilities, making use of p... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: CICC Alpha

Startup Funding: September 2021

Startup Funding: July 2021

Startup Funding: January 2021

Week in Review: IoT, Security, Auto