Securing The IoT Begins With Zero-Touch Provisioning At Scale

By Infineon - 04 Aug, 2021 - Comments: 0

The path to secured IoT deployments starts with a hardware root-of-trust at the device level, a simple concept that belies the complexity of managing a chain of trust that extends from every edge device to the core of the network. The solution to this management challenge, based on a coordinated effort of domain experts, is a zero touch “chip-to-cloud” provisioning service for certificates-... » read more

Data Will Swamp The Internet, Unless We Think Differently

By Arm - 10 Jun, 2020 - Comments: 0

To harvest the IoT device and data opportunity in the coming years, companies must rethink their infrastructure strategy. This means re-imagining computing from the edge to the cloud. Download this report to see how leading teams are transforming their infrastructure strategies today to win tomorrow. Click here to read more. » read more

Edge Complexity To Grow For 5G

By Kevin Fogarty and Ed Sperling - 02 Jul, 2019 - Comments: 0

Edge computing is becoming as critical to the success of 5G as millimeter-wave technology will be to the success of the edge. In fact, it increasingly looks as if neither will succeed without the other. 5G networks won’t be able to meet 3GPP’s 4-millisecond-latency rule without some layer to deliver the data, run the applications and broker the complexities of multi-tier Internet apps ac... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

Securing The IoT Begins With Zero-Touch Provisioning At Scale

Data Will Swamp The Internet, Unless We Think Differently

Edge Complexity To Grow For 5G

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

2D Semiconductors Make Progress, But So Does Silicon