Dealing With Performance Bottlenecks In SoCs

By Brian Bailey - 23 Feb, 2023 - Comments: 0

A surge in the amount of data that SoCs need to process is bogging down performance, and while the processors themselves can handle that influx, memory and communication bandwidth are straining. The question now is what can be done about it. The gap between memory and CPU bandwidth — the so-called memory wall — is well documented and definitely not a new problem. But it has not gone away... » read more

Asynchronous Is Mostly Academic

By Ann Mutschler - 26 Jun, 2014 - Comments: 4

There are a number of interesting technologies to keep an eye on in term of how and when they could be adopted for use in SoC design today, some of which include gallium arsenide, GPGPUs, 3D ICs and asynchronous logic. Asynchronous logic promises a number of benefits in some specific application areas, and one that buoys to the surface for potential near-term use is in the area of security a... » read more

The Smartphonification Of Things

By Ann Mutschler - 28 Mar, 2013 - Comments: 0

By Ann Steffora Mutschler The term, ‘Internet of Things,’ was first coined more than a decade ago by technology visionary Kevin Ashton but has slowly trickled down to the world of chip design and is now mentioned constantly in conversation. The reason is simple: System-level design tools are getting sophisticated enough to handle the intricacies required by devices in an Internet of ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: communications protocols

Dealing With Performance Bottlenecks In SoCs

Asynchronous Is Mostly Academic

The Smartphonification Of Things