Week In Review: Design, Low Power

By Jesse Allen - 27 Aug, 2021 - Comments: 0

The UK's Competition and Markets Authority is raising new challenges for Nvidia's proposed acquisition of Arm, suggesting in a new report that an in-depth Phase 2 investigation into the deal is warranted on competition grounds. Andrea Coscelli, chief executive of the CMA, said, “We’re concerned that Nvidia controlling Arm could create real problems for Nvidia's rivals by limiting their acce... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 02 Aug, 2019 - Comments: 0

Products/Services Rambus agreed to acquire Hillsboro, Ore.-based Northwest Logic, a purveyor of memory, PCIe, and MIPI digital controllers. The transaction is expected to close in the current quarter. Financial terms weren’t disclosed; Rambus said in a statement, “Although this transaction will not materially impact 2019 results due to the expected timing of close and acquisition accountin... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 12 Jul, 2019 - Comments: 0

Products/Services Arteris IP reports that Bitmain licensed the Arteris Ncore Cache Coherent Interconnect intellectual property for use in its next-generation Sophon Tensor Processing Unit system-on-a-chip devices for the scalable hardware acceleration of artificial intelligence and machine learning algorithms. “Our choice of interconnect IP became more important as we continued to increase t... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Competition and Markets Authority

Week In Review: Design, Low Power

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto