Wednesday At DAC 2018

By Brian Bailey - 28 Jun, 2018 - Comments: 0

Wednesday starts with a visionary talk followed by a keynote. The Visionary talk was given by Chidi Chidambaram, VP of engineering for Qualcomm, and looked at 'Challenges to Enable 5G System Scaling.' "We have to start taking a system view rather than just following technology and at the same time we have to get concerned about durability," he said. "Mobile will continue to be the leader becaus... » read more

Monday At DAC 2018

By Brian Bailey - 26 Jun, 2018 - Comments: 0

DAC #55 started with rumors flying. Will this be the last DAC as we know it? Is there a huge chasm forming between academia and the industry? Will DAC be able to make it in Las Vegas where there is no local interest? Of course, those who have been in the industry know that this kind of speculation happens every few years, and in the 80s, Las Vegas was a very popular location for DAC. There was ... » read more

The Week in Review: IoT

By Jeff Dorsch - 22 Jun, 2018 - Comments: 0

Finance Marvell Technology Group priced $500 million in senior notes due in 2023 and $500 million in senior notes due in 2028. The chip company will use net proceeds from the debt offering, cash on hand, and borrowings under a new term loan facility to fund the cash consideration and other amounts payable for Marvell’s proposed $6 billion acquisition of Cavium. The companies have expected to... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: DAC 55

Wednesday At DAC 2018

Monday At DAC 2018

The Week in Review: IoT

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