DAC Day Four: Excitement And Risk

By Brian Bailey - 09 Jun, 2016 - Comments: 0

One thing that was new to DAC this year, was an art exhibit. These were pieces of artwork related to our industry, such as chip plots, or more abstract ideas based on design data or analyses. They received many more entrants than their wildest dreams and had to choose a winner from over 80 pieces, but the grand prize was won by a 3D model of a finFET by David Freid of Coventor. This piece was ... » read more

DAC Day Three: UVM, Machine Learning And DFT Come Together

By Brian Bailey - 08 Jun, 2016 - Comments: 0

The industry and users have a love/hate relationship with UVM. It has quickly risen to become the most used verification methodology and yet at the same time it is seen as being overly complex, unwieldy and difficult to learn. The third day of DAC gets started with breakfast with Accellera to discuss UVM and what we can expect to see in the next 5 years. The discussion was led by Tom Alsop, pri... » read more

DAC Day Two: Down To Business

By Brian Bailey - 07 Jun, 2016 - Comments: 0

DAC day two started with a breakfast presentation put on by Synopsys which included guests from ARM, TSMC and HiSilicon. It was titled Collaborating to Enable Design with the latest processors and finFET processes. Collaboration is a word that we hear increasingly when talking about the advanced nodes and today we are truly at the point where one company cannot do it all. Ron Moore, VP of ma... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: DAC53

DAC Day Four: Excitement And Risk

DAC Day Three: UVM, Machine Learning And DFT Come Together

DAC Day Two: Down To Business