DAC 2019: Day 3

By Brian Bailey - 06 Jun, 2019 - Comments: 0

Two keynotes get day three of DAC started. The first by John Cohn, Massachusetts Institute of Technology & IBM Watson AI Lab. "I am a nerd. Look back 100 years in processing. We have gone from mechanical computing to where we are today, but it has not been a smooth curve. There are smooth places and then discontinuities. This is when what you were working on no longer works. How we make tho... » read more

DAC 2019: Day 2

By Brian Bailey - 05 Jun, 2019 - Comments: 0

Day two of DAC started off with a highly anticipated keynote given by Thomas Dolby, musician, producer and innovator. Dolby has always been fascinated with the convergence of music and technology. He started off with a fanfare by balancing a broom on his finger to demonstrate the type of control we have as human beings. He went on to expand the analogy to the hive mind of groups of individuals,... » read more

DAC 2019: Day 1

By Brian Bailey - 04 Jun, 2019 - Comments: 2

The last time that DAC was in Las Vegas was 2001. Much has changed since then. The first day kicked off with the usual ceremonies and then two short keynotes. A change from previous years is that keynotes are now on the show floor. This is presumably to ensure that once the keynotes are over, everyone sees the vendor booths. During the commencement session, it was also announced that all cof... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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DAC 2019: Day 3

DAC 2019: Day 2

DAC 2019: Day 1