Startup Funding: September 2021

By Jesse Allen - 04 Oct, 2021 - Comments: 0

Startups focused on data center chips had a big month in September. A new emergent from stealth promises to accelerate big data analytics, and startups proving CXL connectivity and high-performance RISC-V chiplets also drew funding. On the other end of the spectrum, NB-IoT and edge AI designers saw investment while a company providing on-chip monitoring can predict when chips will fail. Plus, c... » read more

Making Sense Of New Edge-Inference Architectures

By Bryon Moyer - 04 Mar, 2021 - Comments: 0

New edge-inference machine-learning architectures have been arriving at an astounding rate over the last year. Making sense of them all is a challenge. To begin with, not all ML architectures are alike. One of the complicating factors in understanding the different machine-learning architectures is the nomenclature used to describe them. You’ll see terms like “sea-of-MACs,” “systolic... » read more

Edge-Inference Architectures Proliferate

By Bryon Moyer - 04 Feb, 2021 - Comments: 0

First part of two parts. The second part will dive into basic architectural characteristics. The last year has seen a vast array of announcements of new machine-learning (ML) architectures for edge inference. Unburdened by the need to support training, but tasked with low latency, the devices exhibit extremely varied approaches to ML inference. “Architecture is changing both in the comp... » read more

Week In Review: Design, Low Power

By Jesse Allen - 20 Nov, 2020 - Comments: 0

Synopsys acquired Light Tec, a provider of optical scattering measurements and measurement equipment. The company also provides optical engineering consulting services plus training for use of Synopsys' lighting simulation software. "Light Tec's proven optical measurement capabilities provide our customers with robust new tools for high-accuracy optical product simulations and visualizations," ... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Deep Vision

Startup Funding: September 2021

Making Sense Of New Edge-Inference Architectures

Edge-Inference Architectures Proliferate

Week In Review: Design, Low Power

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