Digital Twin And The Implications For Semiconductor Suppliers

By Jacob Wiltgen - 02 Jul, 2024 - Comments: 0

Automotive is a prime example of one industry where advanced semiconductors are forcing change across all aspects of vehicle development. Accelerated investment is fueling this industry wide evolution, driven by new business models, environmental regulations, and the evolution toward fully autonomous, software-defined vehicles. The demand for fully and semi-autonomous systems has a particula... » read more

Five Digital Threads Unify And Simplify Electronic Systems Design And Manufacturing

By Matt Walsh - 25 Jan, 2024 - Comments: 0

By Matthew Walsh and Matt Bromley Digital transformation involves the integration of digital technologies and the reimagining of business processes to enhance operations, improve customer experiences, and drive innovation. Digital threads are a key component of this transformation, as they enable the seamless flow of data and information across various stages of a process, system, or organiz... » read more

Weaving A Digital Thread For Design And Manufacture Of Additive Electronics

By Dave Wiens - 04 Jan, 2024 - Comments: 0

Additive manufacturing has been around electronics since thick-film, screened hybrids came on the scene more than 30 years ago. And while those never quite went away, they never gained the prominence we all expected alongside the more traditional laminated, subtractive-etched PCBs. Today, emerging technologies are bringing a resurgence in additive manufacturing, also known as printed electro... » read more

Manufacturing Optimization With Digital Thread

By Michael Schuldenfrei - 10 Mar, 2020 - Comments: 0

Data is everywhere, and if you know what to do with it, can be tremendously valuable. Huge volumes of data are collected in manufacturing industries across the supply chain, with the help of technologies such as IoT platforms, sensors, and edge devices. However, data is only as good as the value extracted from it, and getting the most out of data is challenging. Because information is often con... » read more

Coordinating Automotive Embedded Software Development Requires A Unified Approach

By Piyush Karkare - 03 Oct, 2019 - Comments: 0

The rising intelligence and connectivity of vehicles are making the interactions between software and physical systems more complex, exposing the deficiencies of current processes, tools and methods. To compete in the technological race for the future of mobility, companies must evolve their software development processes today. A common digital thread connecting software and physical systems t... » read more

Data Sharing And Digital Threads

By Michael Schuldenfrei - 07 May, 2019 - Comments: 0

Electronics and the components that power them are more complex and advanced than ever. With these products an integral part of our daily lives, their reliability has become nothing less than mission-critical. As the demand for components accelerates, it is important that quality is not compromised under the pressure to meet quantity requirements. Otherwise we’re going to be seeing a lot of r... » read more

Digital Twins Deciphered

By Brian Bailey - 28 Mar, 2019 - Comments: 0

Ever since Siemens acquired Mentor Graphics in 2016, a new phrase has become more common in the semiconductor industry – the digital twin. Exactly what that is, and what impact it will have on the semiconductor industry, is less clear. In fact, many in the industry are scratching their heads over the term. The initial reaction is that the industry has been creating what are now termed digi... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer