Manufacturing Bits: Sept. 9


Fusion energy The U.S. Department of Energy (DOE) has announced $29 million in funding for several projects to develop fusion energy technology. The projects will focus on the components, materials and technologies to develop a long-awaited but elusive net-energy-gain “fusion core.” For years, companies, governments and universities have been working on fusion power technology. Fu... » read more

Manufacturing Bits: Sept. 1


AI, quantum computing R&D centers The White House Office of Science and Technology Policy, the National Science Foundation (NSF), and the U.S. Department of Energy (DOE) have announced over $1 billion in awards for the establishment of several new artificial intelligence and quantum information science (QIS) research institutes in the U.S. Under the plan, the U.S. is launching seven new... » read more

Week In Review: Manufacturing, Test


Trade As reported, the U.S. recently implemented more restrictions on U.S. chip sales to Huawei. In response, SEMI has released the following statement in response to the new export control rule changes announced by the U.S. Commerce Department: “SEMI recognizes the role of export control measures to address threats to U.S. national security. However, we are very concerned the new export ... » read more

Manufacturing Bits: Aug. 18


Quantum Internet The U.S. Department of Energy (DOE) recently unveiled a strategy to develop a quantum Internet in the United States. DOE’s 17 National Laboratories will serve as the backbone of the quantum Internet, which will rely on the laws of quantum mechanics to control and transmit information over a network. Currently in its initial stages of development, the quantum Internet coul... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Senator Patrick Leahy (D-Vt.), Senator Chuck Schumer (D-N.Y.) and Senator Jack Reed (D-R.I.) have sent a letter to officials from the Trump administration, demanding answers about TSMC’s recent announcement to build a fab in Ariz. As reported, TSMC has announced its intention to build and operate an advanced semiconductor fab in the U.S. The fab, to be built in Arizona, w... » read more

Manufacturing Bits: May 11


Covid-19 data mining Using machine learning and other technologies, Lawrence Berkeley National Laboratory (Berkeley Lab) has developed a data text-mining tool to help synthesize a growing amount of scientific literature on Covid-19. Each day, some 200 new journal articles are being published on the coronavirus alone, according to Berkeley Lab. Berkeley Lab’s data mining tool, which is liv... » read more

Manufacturing Bits: March 24


Autonomous microscopes FLEET, also known as the ARC Centre of Excellence in Future Low-Energy Electronics Technologies, has developed an autonomous scanning probe microscopy (SPM) technology. SPM is an instrument that makes use of an atomically sharp probe. The probe is placed in close proximity above the surface of a sample. With the probe, the SPM forms images of the surface of the sample... » read more

Manufacturing Bits: Feb. 18


Molecular layer etch The U.S. Department of Energy’s Argonne National Laboratory has made new advances in the field of molecular layer etching or etch (MLE). MLE is related to atomic layer etch (ALE). Used in the semiconductor industry, ALE selectively removes targeted materials at the atomic scale without damaging other parts of the structure. ALE is related to atomic layer deposition... » read more

Manufacturing Bits: Feb. 10


Accelerating and cooling muons Using a novel particle accelerator, a group for the first time have observed a phenomenon called muon ionization cooling–an event that could give researchers a better understanding of matter and the universe. Muons are obscure sub-atomic particles. This experiment could pave the way towards the development of new and powerful muon particle accelerators. Thes... » read more

Manufacturing Bits: Oct. 15


Sandia’s fab upgrade Sandia National Laboratories has completed the first phase of a three-year upgrade program in its semiconductor wafer fab. The goal of the program is to convert Sandia’s Albuquerque, N.M.-based fab from 150mm (6-inch) to 200mm (8-inch) wafer sizes. As part of the move, Sandia is converting its 0.35-micron (350nm) rad-hard process from 150mm to 200mm. The process is ... » read more

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