Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 09 Dec, 2022 - Comments: 0

Pervasive computing Swedish-based Ericsson is selling its IoT business platform to Aeris for an undisclosed amount. Ericsson will transfer its IoT Accelerator and Connected Vehicle Cloud businesses and assets to Aeris, a company that focuses on industrial, automotive, and medical IoT networks. The complexity and fragmentation of the IoT space requires more custom and hands on maintenance. Acco... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 14 Dec, 2018 - Comments: 0

Internet of Things Arm made five 2019 predictions for the Internet of Things. They are: The intelligent home goes mainstream; personalized delivery options; improved health-care service; smart cities seek to improve revenue streams and citizen engagement; and smart buildings use more technology for efficiencies. The company also commissioned a worldwide survey of 2,000 consumers, conducted by ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 31 Aug, 2018 - Comments: 1

Internet of Things Electrolux, Haier, LG Electronics, and Samsung Electronics announced they are working with the Open Connectivity Foundation, an Internet of Things standards body, to build, commercialize, and deploy interoperable OCF-Certified connected products during 2019. In addition, the OCF is launching an enhanced security model and secure cloud management capabilities, making use of p... » read more

Blog Review: May 20

By Jesse Allen - 20 May, 2015 - Comments: 0

FinFETs change the equation for power optimization, says Mentor's Vincent Lebars – and while companies are attacking some power gains, there is much more to be had doing datapath optimization within the place and route flow. Cadence's Richard Goering talks with Oz Levia about the future direction of formal and its integration into other product lines now that the merger between Cadence and... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Dyson

Week In Review: Auto, Security, Pervasive Computing

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

Blog Review: May 20