Week in Review: IoT, Security, Auto

By Jeff Dorsch - 18 Jan, 2019 - Comments: 0

Internet of Things A dairy barn without any people working in it. An automated greenhouse for produce. Coming soon, little robots that will weed crop fields and look for diseased plants. This is Rivendale Farms, in the countryside west of Pittsburgh, which is 175 acres serving as a beta site for agricultural Internet of Things technology. The small farm has about 150 Jersey cows, each of which... » read more

October ’18 Startup Funding: IoT, Security, Auto

By Jeff Dorsch - 02 Nov, 2018 - Comments: 0

Billions were raised in October for Internet of Things, cybersecurity, automotive electronics, and related technology startups. Automotive October fundings rolled in on the automotive side for Israel’s VayaVision ($8 million) and South Korea-based SOS LAB ($6 million Series A), which are developing products for autonomous vehicles. Silicon Mobility ($10 million Series B), a French startup... » read more

The Week in Review: IoT

By Jeff Dorsch - 11 May, 2018 - Comments: 0

Conferences Internet of Things World 2018 takes place next week at the Santa Clara Convention Center in Silicon Valley. Executives of GE Digital, The Chamberlain Group, and UPS will be among those giving keynote addresses during the four-day conference. Monday will see pre-conference workshops, followed by three days of keynotes, presentations, and an expo floor taking in 100,000 square feet o... » read more

The Week In Review: IoT

By Jeff Dorsch - 27 May, 2016 - Comments: 0

Tools Mentor Graphics rolled out a tester for thermal reliability of electric and hybrid vehicles during power cycling. The tester is the first of its kind. Deals Rambus signed a deal with Eurobank Poland for a cloud-based mobile payment system. The deal involves Secure Element in the Cloud software from Bell ID, which Rambus acquired in January. Eurobank Poland has more than 1 million cus... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: E.On

Week in Review: IoT, Security, Auto

October ’18 Startup Funding: IoT, Security, Auto

The Week in Review: IoT

The Week In Review: IoT