February ’19 Startup Funding: Big Cash Keeps Rolling In

By Jeff Dorsch - 07 Mar, 2019 - Comments: 0

Sixteen startups received private funding rounds of $100 million and up during February, including three that took in 10-figure rounds. Those 16 companies raised more than $8 billion in total. The SoftBank Vision Fund invested $1.5 billion in China's Chehaoduo, an online car trading group that includes Guazi.com, a used-car trading platform, and Maodou.com, which retails new sedans through d... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 03 Aug, 2018 - Comments: 0

Deals Arm acquired Treasure Data, which offers a data management service. Financial terms weren’t revealed, although the transaction is reportedly worth $600 million. Joyce Kim, Arm’s chief marketing officer, told reporters that the purchase is “the largest cash deal we’ve done.” Along with the company’s introduction of Mbed Cloud (a device management service) last year and the acq... » read more

The Week in Review: IoT

By Jeff Dorsch - 08 Jun, 2018 - Comments: 0

Finance CyberInt raised $18 million in new funding led by Viola Growth and including existing investors. The company provides cybersecurity detection and response services. CyberInt has offices in Israel, the U.S., the United Kingdom, Singapore, and Panama. San Diego-based Kneron, which provides artificial intelligence technology for edge devices, received $18 million in Series A1 funding l... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Eastern Bell Venture Capital

February ’19 Startup Funding: Big Cash Keeps Rolling In

Week in Review: IoT, Security, Auto

The Week in Review: IoT