Week In Review: Design, Low Power

By Jesse Allen - 07 Jan, 2022 - Comments: 0

SK Hynix completed the first phase of its acquisition of Intel's NAND and SSD business. In this first step it took control Intel’s SSD business and the Dalian NAND flash manufacturing facility in China, for a price of $7 billion. Next, it will acquire from Intel the remaining assets in relation to its NAND business, including IP related to the manufacture and design of NAND flash wafers, R&am... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 07 Jan, 2022 - Comments: 0

Automotive As part of its in-cabin monitoring wares at Consumer Electronics Show (CES) 2022, U.S.-based Gentex demonstrated the Vaporsens gas sensors, a nanofiber chemical sensor technology that monitors cabin air quality and can ID airborne contaminants. One use would be to monitor if outside contaminants get into the cabin, the sensor could trigger the car to turn on the recirculation of air... » read more

Startup Funding: April 2021

By Jesse Allen - 03 May, 2021 - Comments: 0

April showers brought mega fundraising rounds to the semiconductor industry. In China, a mobile chipset maker looking to go public won significant funding along with partnerships with major smartphone companies. In the US, AI hardware startups are drawing interest with unique processor architectures and business models. Plus, a major test and design services company drew new investment. This mo... » read more

System Bits: Dec. 11

By Jeff Dorsch - 11 Dec, 2018 - Comments: 0

Calculating the costs of autonomous vehicles The development of autonomous vehicle technology commands a lot of media coverage. Little reporting has been devoted to the costs of operating AVs, a subject that developers don’t discuss in general. The Houston-Galveston Area Council’s website recently divulged contract figures with two startups, Drive.ai and EasyMile. For Silicon Valley-bas... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: EasyMile

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

Startup Funding: April 2021

System Bits: Dec. 11

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Entities, people and technologies explored