China’s Impact On The Semiconductor Market

By Bob Smith - 08 Feb, 2016 - Comments: 2

China’s impact on the semiconductor market is unmistakable. The question so many industry watchers wonder: Is it the new center of the semiconductor universe? Some statistics may help determine the answer. China topped the list of five worldwide exporters in 2014, with the European Union coming in second. The U.S. finished third, followed by Germany and, in fifth place, Japan. (See Fig. 1... » read more

Predictions For 2016: Tools and Flows

By Brian Bailey - 28 Jan, 2016 - Comments: 0

Seventeen companies sent in their predictions for this year with some of them sending predictions from several people. This is in addition to the CEO predictions that were recently published. That is a fine crop of views for the coming year, especially since they know that they will be held accountable for their views and this year, just like the last, they will have to answer for them. We beli... » read more

The Week In Review: Design/IoT

By Jesse Allen - 08 Jan, 2016 - Comments: 0

EDA & IP EDA revenues increased 7.1% for Q3 2015, according to the EDA Consortium, upping the number to $1957.5 million, compared to $1828.1 million in Q3 2014. The four-quarters moving average also jumped by 8.8%. IC Physical Design & Verification saw the biggest gains, with a 14% increase compared to Q3 2014 and $407.9 million in revenue for the quarter. IP was runner up, with $652... » read more

EDA Up, Japan Continues To Slide

By Ed Sperling - 16 Jan, 2015 - Comments: 0

EDA numbers grew 5.7% in the third quarter, propelled by demand for PCB tools in the booming automotive market and IP sales around the globe, according to the latest statistics from the EDA Consortium. The classic EDA tools business was down slightly for the quarter, but PCB tools jumped 9.7%. "There are new capabilities for packaging and wiring for automotive," said Wally Rhines, board ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: EDA Consortium

China’s Impact On The Semiconductor Market

Predictions For 2016: Tools and Flows

The Week In Review: Design/IoT

EDA Up, Japan Continues To Slide