Week In Review: Design, Low Power

By Jesse Allen - 13 Sep, 2019 - Comments: 0

M&A ANSYS will acquire Livermore Software Technology Corp. (LSTC), a provider of explicit dynamics and other advanced finite element analysis technology. Based in Livermore, CA, LSTC was founded in 1987 to commercialize the DYNA3D technology developed at the Lawrence Livermore National Laboratory. DYNA3D became the company's premier product LS-DYNA, a general purpose nonlinear finite eleme... » read more

Week In Review: Design, Low Power

By Jesse Allen - 06 Sep, 2019 - Comments: 0

Rambus will acquire the Silicon IP, Secure Protocols and Provisioning business from Verimatrix, formerly Inside Secure. The secure silicon IP and provisioning solutions from both companies will be integrated into a single portfolio of products and the embedded security teams from Verimatrix will join Rambus. “Integrating the Verimatrix embedded security team into Rambus, a recognized leader i... » read more

June’19 Startup Funding

By Jeff Dorsch - 11 Jul, 2019 - Comments: 0

During the month of June, there were 15 startups that brought in funding rounds of $100 million or more, as investors continued to chase deals in cybersecurity, automotive technology, semiconductors, and a variety of services. There were no billion-dollar deals as spring slid into summer; yet, those 15 companies together raised a total of about $3.13 billion. Aurora Innovation, the developer... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Edge Case Research

Week In Review: Design, Low Power

Week In Review: Design, Low Power

June’19 Startup Funding

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