Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 07 Jul, 2023 - Comments: 0

Joby Aviation and Alef Automotive each received a Special Airworthiness Certificate from the U.S. Federal Aviation Administration (FAA) for an electric vertical take-off and landing (eVTOL) aircraft. Joby will now begin flight testing the prototype, and the aircraft will move to Edwards Air Force Base in 2024 as part of a contract with the U.S. Air Force. Alef’s model is the first U.S. govern... » read more

Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 30 Jun, 2023 - Comments: 0

Inflection AI raised $1.3 billion in a new funding round led by Microsoft, Reid Hoffman, Bill Gates, Eric Schmidt, and NVIDIA after raising $225 million in the first round to support the ongoing development of Pi, a “useful, friendly, and fun” AI. In partnership with CoreWeave and NVIDIA, Inflection aims to build the world’s largest AI cluster, comprised of 22,000 NVIDIA H100 Tensor Core ... » read more

Week In Review: Automotive, Security and Pervasive Computing

By Linda Christensen - 31 Mar, 2023 - Comments: 0

The Biden administration uncorked a fueling station locator tool to help consumers locate charging stations by fuel type, a plan to install 24,000 charging stations at federal facilities by next fiscal year, as well as other clean energy commitments. Source: Department of Energy: Alternative Fuels Data Center & Station Locator Europe is making progress on a plan that requires all ... » read more

Week In Review: Auto, Security, Pervasive Computing

By Marie C. Baca - 11 Nov, 2022 - Comments: 0

Automotive And Mobility Two major auto OEMs revealed new electric vehicle models this week. The Audi Q8 e-tron has 40 driver assistance systems including five radar sensors, five cameras, and 12 ultrasonic sensors, and comes with either an 89 net kilowatt-hour battery or a 106 net kilowatt-hour battery. It arrives in the U.S. in April 2023. The Volvo EX90 contains both lidar and 5G connectivit... » read more

Knowledge Centers
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Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: electric vehicle news

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Automotive, Security and Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing

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