The Hidden Security Risks Of Automotive Electronic Systems

By Adrian Cosoroaba - 06 Apr, 2023 - Comments: 0

The Internet of things (IoT) is driving new capabilities that are transforming how we live, work and play. However, as our lives become more connected, the risk from hackers and other security breaches increases with every new IoT device. While most of us are pretty well versed in why we need to keep our most trusted devices secure – such as cell phones and laptops – we often don’t think ... » read more

The MCU Dilemma

By Brian Bailey - 13 Feb, 2020 - Comments: 2

The humble microcontroller is getting squeezed on all sides. While most of the semiconductor industry has been able to take advantage of Moore's Law, the MCU market has faltered because flash memory does not scale beyond 40nm. At the same time, new capabilities such as voice activation and richer sensor networks are requiring inference engines to be integrated for some markets. In others, re... » read more

Simplifying Ultra-Low Power System Design

By Paul Hill - 12 Sep, 2019 - Comments: 0

By Paul Hill and Gordon MacNee With any low-power design, the designer has the choice between choosing low-power components or switching off the power to peripheral devices. When considering the choice of non-volatile flash memories, the designer has these same two options available to them – each of which has its pros and cons from system operation, power consumption and reliability persp... » read more

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Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: embedded flash

The Hidden Security Risks Of Automotive Electronic Systems

The MCU Dilemma

Simplifying Ultra-Low Power System Design

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