Open-Source NFV

By Bob Monkman - 29 Jun, 2017 - Comments: 0

The OPNFV Summit in Beijing earlier this month brought together developers, end users, and other communities all working to advance open source Network Functions Virtualization (NFV). What's new is an effort to make NFV more efficient. A highlight of the event was the announcement of an exciting new platform for accelerating NFV software development, the “NFV PicoPod”. Developed in coll... » read more

The Week In Review: Design/IoT

By Jesse Allen - 08 May, 2015 - Comments: 0

Embedded Mentor Graphics released a new version of their Nucleus RTOS with a focus on high-performance IoT and wearable applications. Updates include support for Dynamic Linking and Loading (DLL) capabilities in Cortex-M based cores; the ability for developers to reconfigure, update, and provision connected embedded devices that utilize cloud-based remote software services; and TI WiLink 8 m... » read more

Easing System Creation With Embedded Hardware Solutions And Standards

By Cheryl Ajluni - 27 Mar, 2009 - Comments: 0

By Cheryl Ajluni System creation is today an ultra-complex task. On one hand, developers are confronted with consumer demands for ever more functionality, better performance and increased power efficiency at a lower cost. On the other hand, they face stringent time-to-market requirements and changing standards, coupled with the need to accommodate a range of requirements pertaining to differen... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Open-Source NFV

The Week In Review: Design/IoT

Easing System Creation With Embedded Hardware Solutions And Standards

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