March’19 Startup Funding: Money Springs Forth

By Jeff Dorsch - 04 Apr, 2019 - Comments: 0

Another month, another couple of billion-dollar rounds. Singapore-based Grab raised nearly $1.5 billion from the SoftBank Vision Fund, bringing its total private funding to more than $4.5 billion and valuing the company at around $14 billion. Grab has acquired Uber’s ride-hailing business in Southeast Asia and now competes chiefly with Go-Jek of Indonesia in Thailand and other emerging mar... » read more

The Week in Review: IoT

By Jeff Dorsch - 09 Mar, 2018 - Comments: 0

Finance Toronto-based Ecobee, which markets smart thermostats, raised $61 million in its Series C funding, bringing the total funding for the 11-year-old company to $146 million. Energy Impact Partners led the new round and was joined by Amazon’s Alexa Fund, Relay Ventures, and Thomvest. Ecobee counts Nest Labs, the Google subsidiary, as its chief rival. ThoughtWire, also headquartered in... » read more

The Week In Review: IoT

By Jeff Dorsch - 27 May, 2016 - Comments: 0

Tools Mentor Graphics rolled out a tester for thermal reliability of electric and hybrid vehicles during power cycling. The tester is the first of its kind. Deals Rambus signed a deal with Eurobank Poland for a cloud-based mobile payment system. The deal involves Secure Element in the Cloud software from Bell ID, which Rambus acquired in January. Eurobank Poland has more than 1 million cus... » read more

Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

Defining The Chiplet Socket

The industry may have started with the wrong approach for enabling a third-party chiplet ecosystem, but who will step in and fix it?

by Brian Bailey

tag: Energy Impact Partners

March’19 Startup Funding: Money Springs Forth

The Week in Review: IoT

The Week In Review: IoT

Trending Articles

NAND Flash Targets 1,000 Layers

Auto Chip Aging Accelerates In Hot Climates

FOPLP Gains Traction in Advanced Semiconductor Packaging

HBM Options Increase As AI Demand Soars

Is In-Memory Compute Still Alive?

Knowledge Centers
Entities, people and technologies explored