Week in Review: IoT, Security, Autos

By Jeff Dorsch And Susan Rambo - 18 Oct, 2019 - Comments: 0

Products/Services The Networking for Autonomous Vehicles Alliance announces that Marvell Semiconductor is joining the NAV Alliance following its acquisition of Aquantia. Fourteen companies are in the industry organization, including Bosch, Continental, Nvidia, and Volkswagen. “The NAV Alliance is developing the platforms that will create the future of transportation and we believe that Multi... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 06 Jul, 2018 - Comments: 1

Deals SoftBank Corp. reached an agreement with Indonesia’s Link Net to work together on Internet of Things technology. Hidebumi Kitahara of SoftBank said in a statement, “The global mobile industry is now entering the 5G era, with IoT becoming the central focal point of innovation. This partnership with Link Net shows our strong commitment to further boost technology innovation in the glob... » read more

Week in Review: IoT, Auto, Security

By Jeff Dorsch - 29 Jun, 2018 - Comments: 0

Executive Changes Rambus' board of directors named Luc Seraphin, senior vice president and general manager of the company's Memory and Interfaces Division, as interim CEO while it searches for a replacement for Ron Black. The board terminated Black this week, saying the reason for termination did not involve Rambus' financial and business performance. The company also named Mike Noonen as se... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: EQT Partners

Week in Review: IoT, Security, Autos

Week in Review: IoT, Security, Auto

Week in Review: IoT, Auto, Security