The Week in Review: IoT

By Jeff Dorsch - 30 Mar, 2018 - Comments: 0

Regulation The Consumer Product Safety Commission is accepting public comments on “potential safety issues and hazards associated with Internet-connected consumer products.” The agency is concerned about “unexpected operating conditions” with Internet of Things devices, along with hacking that could start fires through a stovetop or grill, and the potential compromising of home safety ... » read more

The Week In Review: IoT

By Jeff Dorsch - 09 Dec, 2016 - Comments: 0

Analysis Some consumer IoT products are actually useful and helpful in daily life, such as the Nest Learning Thermostat and the Honeywell Lyric for home automation, David Pogue writes. Then there are the products that make most people scratch their heads – IoT water bottles, the IoT toilet-paper dispenser, the IoT toothbrush, IoT umbrella, IoT fork, the IoT egg tray, and so on, he notes. “... » read more

Conferences, Education And The Press

By Brian Bailey - 25 Sep, 2014 - Comments: 1

The EDA industry once organized itself around conferences. The Design Automation Conference (DAC) marked the time of the year when new product announcements came out thick and fast, and it was difficult to keep up with the stream of press releases. Companies with nothing to announce were viewed as deficient. New products were demonstrated in secrecy in the back rooms of the suites at the confer... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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The Week in Review: IoT

The Week In Review: IoT

Conferences, Education And The Press