tag: European Commission

System Bits: Oct. 9
By Jeff Dorsch - 09 Oct, 2019 - Comments: 0

Bringing plasmonic color to solid materials Researchers at the University of California, Riverside, used silver nanoparticles (AgNPs) to produce plasmonic color-switchable films for solid materials. This effect was previously achieved only in liquids. Rapid and reversible tuning of plasmonic color in solid films, a challenge until now, holds great promise for a number of applications,” sa... » read more

Week in Review – IoT, Security, Autos
By Jeff Dorsch - 27 Sep, 2019 - Comments: 0

Products/Services Achronix Semiconductor joined Taiwan Semiconductor Manufacturing’s IP Alliance Program, part of the foundry’s Open Innovation Platform. Achronix’s Speedcore eFPGA IP is available today on TSMC 16nm FinFET Plus (16FF+) and N7 process technologies, and it will be soon available on TSMC 12nm FinFET Compact Technology (12FFC). Cadence Design Systems announced that its di... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 29 Mar, 2019 - Comments: 0

Internet of Things Organizers for the Internet of Things World 2019 conference, coming up on May 13-16 in Santa Clara, Calif., surveyed more than 100 IoT leaders in various industries. Implementation (34%) and security (25%) were the highest concerns for the respondents. Those were followed by initial purchase (17%), scalability (10%), business buy-in (8%), and upkeep costs (3%). Two-thirds of... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 08 Feb, 2019 - Comments: 0

Chipmakers and OEMs Diamond semiconductor IP vendor AKHAN Semiconductor is cooperating with a U.S. federal investigation into alleged theft of its intellectual property by China’s Huawei. When AKHAN agreed to send its proprietary technology to Huawei pursuant to an agreement, AKHAN “believes that Huawei destroyed our product, shipped it to China without authorization, subjected it to tests... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 Dec, 2018 - Comments: 0

Chipmakers Foxconn is in talks to build a fab in Zhuhai, China, according to a report from Nikkei. The fab, to cost $9 billion, would make chips for Foxconn and outside companies, the report said, which says the company will enter the foundry business. The European Commission has approved funding for 1.75 billion euros ($2 billion) of public investment for projects in the microelectronics... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 16 Nov, 2018 - Comments: 0

Internet of Things Gartner identified what it says are the top 10 strategic Internet of Things technologies and trends. Number one, no surprise, is artificial intelligence. Nick Jones, research vice president at Gartner, said in a statement, “AI will be applied to a wide range of IoT information, including video, still images, speech, network traffic activity, and sensor data.” Other top t... » read more

The Week in Review: IoT
By Jeff Dorsch - 19 Jan, 2018 - Comments: 0

Finance VDOO Connected Trust received $13 million in seed funding led by 83North, with participation by Dell Technology Capital and individual investors David Strohm, Joe Tucci, and Victor Tsao. The startup offers Internet of Things device developers the capability to add cybersecurity features to those devices after they’re deployed. VDOO was founded last year in Israel by Netanel Davidi, U... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Sep, 2017 - Comments: 0

Chipmakers GlobalFoundries has asked European antitrust regulators to investigate TSMC over alleged unfair competition, according to a report from Reuters. Commenting on the report, a spokeswoman for GlobalFoundries said: “We are not surprised that the European Commission is looking into anti-competitive market practices and abusive conduct in the semiconductor sector. The semiconductor indu... » read more

Manufacturing Bits: Sept. 12
By Mark LaPedus - 12 Sep, 2017 - Comments: 0

Failure analysis for 2.5D/3D chips Imec has developed a new failure analysis method to localize interconnection failures in 2.5D/3D stack die with through-silicon vias (TSVs). This technique is called LICA, which stands for light-induced capacitance alteration. It addresses the reliability issues for 2.5D/3D devices in a non-destructive and cost-effective manner at the wafer level. For s... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 11 Aug, 2017 - Comments: 0

Fab tools Lam Research held an analyst event this week. The company indicated that the industry is in the midst of a memory boom, including both DRAM and 3D NAND. According to Amit Daryanani, an analyst with RBC, here was one of the big takeaways at the event: “The memory spend portion of WFE is more sustainable than previously assumed due to end-market drivers such as big data, automation, ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy