Marangoni Effect-Based Under-Layer For A Dual Damascene Via-First Approach

By Brewer Science - 19 Aug, 2021 - Comments: 0

One of the main challenges of a Dual Damascene (DD) via-first process is the control of the Critical Dimensions (CDs) in the lithography of the trenches. The PhotoResist (PhR) thickness presents variations from the via arrays to the open areas, which cause the variation of CDs: the swing effect. The planarization of a DD via-first process is reported. A dual-layer solution is used to demonst... » read more

Improving EUV Underlayer Coating Defectivity Using Point-Of-Use Filtration

By Brewer Science - 18 Nov, 2020 - Comments: 0

Authors: Aiwen Wu (Entegris, Inc. — United States), Hareen Bayana (Entegris GmbH — Germany), Philippe Foubert (imec — Belgium), Andrea Chacko and Douglas Guererro (Brewer Science, Inc. — United States). This paper describes efforts to leverage different filtration parameters, including retention ratings and membrane materials, to understand their impact on EUV underlayer coating defe... » read more

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Marangoni Effect-Based Under-Layer For A Dual Damascene Via-First Approach

Improving EUV Underlayer Coating Defectivity Using Point-Of-Use Filtration

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tag: EUV underlayer coating

Marangoni Effect-Based Under-Layer For A Dual Damascene Via-First Approach

Improving EUV Underlayer Coating Defectivity Using Point-Of-Use Filtration

Trending Articles

Shift Left Is The Tip Of The Iceberg

NAND Flash Targets 1,000 Layers

One Chip Vs. Many Chiplets

FOPLP Gains Traction in Advanced Semiconductor Packaging

HBM Options Increase As AI Demand Soars

Knowledge Centers Entities, people and technologies explored

Related Articles

Shift Left Is The Tip Of The Iceberg

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AI’s Role In Chip Design Widens, Drawing In New Startups

What Comes After HBM For Chiplets

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New AI Processors Architectures Balance Speed With Efficiency

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