Week in Review: IoT, Security, Auto

By Jeff Dorsch - 01 Feb, 2019 - Comments: 0

Internet of Things Pepper IoT collaborated with the Dark Cubed cybersecurity firm to produce “The State of IoT Security Report,” which can be downloaded here. Pepper IoT is an Internet of Things platform and service provider. Key findings of the report: Device security is important, but the platform is much more critical; patching will not fix systemic problems; and the market must make se... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 11 Jan, 2019 - Comments: 0

Internet of Things Automotive, health care, manufacturing, and the public sector could be transformed this year by Internet of Things technology, Bob Violino writes. Taqee Khaled, director of strategy at Nerdery, a digital business consultancy, predicts 2019 will see rapid evolution in enterprise IoT pilot initiatives and implementations. "This acceleration is due, in part, to advances in manu... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 07 Dec, 2018 - Comments: 0

Internet of Things DHL Supply Chain reports that it will spend $300 million to install Internet of Things sensors and collaborative robots in its North American warehouses, bringing 60% of those facilities up to automation capabilities already implemented in 85 of DHL’s 430 warehouses in North America. The company will also employ robotic process automation software and other programs to red... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 21 Nov, 2018 - Comments: 0

Internet of Things Forrester Research released its 2019 Internet of Things predictions. Some key points: Bundled service offerings will catalyze a sleepy consumer IoT market; cybercriminals will lay siege to a smart-city implementation; and a market for IoT managed services will emerge in 2019. Black Friday and Cyber Monday are coming up. Those days present some opportunities to purchase ... » read more

Knowledge Centers
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Shift Left Is The Tip Of The Iceberg

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Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

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Memory Fundamentals For Engineers

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tag: Evergrande Health Industry Group

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto