Simulation-driven EV Battery Pack Design And Manufacturing In The Decade Of Vehicle Electrification

By Puneet Sinha - 07 May, 2020 - Comments: 0

In the last decade, the electric vehicle (EV) industry has grown tremendously from just few offerings to today, when every automaker is working to electrify its vehicle portfolio. A lion’s share of this growth can be attributed to the advancements in lithium-ion (Li-ion) battery technology. Since 2010, Li-ion battery costs have come down by 87% [1] and energy density has tripled [2]. Automake... » read more

Power/Performance Bits: Nov. 19

By Jesse Allen - 19 Nov, 2019 - Comments: 0

Quantum communications chip Researchers at Nanyang Technological University, Australian National University, A∗STAR, University of Science and Technology of China, Singapore University of Technology and Design, Sun Yat-sen University, Beijing University of Posts and Telecommunications, and National University of Singapore built an integrated silicon photonic chip capable of performing quantu... » read more

Building Powertrains To Meet EV Demand

By Peter Hodgins - 12 Nov, 2019 - Comments: 0

Throughout history, customer demand has always been a driving factor in companies’ product portfolios around the world. Today, the demand for a cleaner earth is unparalleled, with individuals wanting products and services that minimize harm to the environment. This amazing transition in customer demand is apparent everywhere. The food industry is experiencing a rise in vegan requests, the ... » read more

Week in Review: IoT, Security, Autos

By Jeff Dorsch - 25 Oct, 2019 - Comments: 0

Products/Services Rambus reports completing the sale of its Payments and Ticketing businesses to Visa for $75 million in cash. “With 30 years of experience pushing the envelope in semiconductor design, we look toward a future of continued innovation to carry on our mission of making data faster and safer,” Rambus President and CEO Luc Seraphin said in a statement. “Completing this transa... » read more

Week in Review: IoT, Security, Autos

By Jeff Dorsch And Susan Rambo - 18 Oct, 2019 - Comments: 0

Products/Services The Networking for Autonomous Vehicles Alliance announces that Marvell Semiconductor is joining the NAV Alliance following its acquisition of Aquantia. Fourteen companies are in the industry organization, including Bosch, Continental, Nvidia, and Volkswagen. “The NAV Alliance is developing the platforms that will create the future of transportation and we believe that Multi... » read more

System Bits: Oct. 15

By Jeff Dorsch - 15 Oct, 2019 - Comments: 0

When self-driving cars collide As self-driving car technology develops and evolves, it is inevitable that there will be collisions while the tech matures. “What can we do in order to minimize the consequences?” asks Amir Khajepour, a professor of mechanical and mechatronics engineering at the University of Waterloo. “That is our focus.” The first rule for the autonomous vehicle (... » read more

Week in Review – IoT, Security, Autos

By Jeff Dorsch - 11 Oct, 2019 - Comments: 0

Products/Services Arm TechCon got under way with a series of announcements. Arm is a founding member of the Autonomous Vehicle Computing Consortium, along with General Motors, Toyota Motor, DENSO, Continental, Bosch, NXP Semiconductors, and Nvidia. More information on the consortium is available here. “Imagine a world where vehicles are able to perceive their dynamically changing environment... » read more

Week in Review – IoT, Security, Autos

By Jeff Dorsch - 04 Oct, 2019 - Comments: 0

Products/Services Cadence Design Systems is working with Adesto Technologies to grow the Expanded Serial Peripheral Interface (xSPI) communication protocol ecosystem, for use in Internet of Things devices. The Cadence Memory Model for xSPI allows customers to ensure optimal use of the octal NOR flash with the host processor in an xSPI system, including support for Adesto’s EcoXiP octal xSPI ... » read more

Week in Review – IoT, Security, Autos

By Jeff Dorsch - 27 Sep, 2019 - Comments: 0

Products/Services Achronix Semiconductor joined Taiwan Semiconductor Manufacturing’s IP Alliance Program, part of the foundry’s Open Innovation Platform. Achronix’s Speedcore eFPGA IP is available today on TSMC 16nm FinFET Plus (16FF+) and N7 process technologies, and it will be soon available on TSMC 12nm FinFET Compact Technology (12FFC). Cadence Design Systems announced that its di... » read more

Week in Review – IoT, Security, Autos

By Jeff Dorsch - 20 Sep, 2019 - Comments: 0

Products/Services Synopsys had a lot of announcements this week! Summer is definitely over. The company released BSIMM10 study, the latest version of the Building Security in Maturity Model, helping organizations plan, execute, mature, and measure their software security initiatives. It also released LucidShape version 2019.09, the latest version of that tool for the design, simulation, and an... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: EVs

Simulation-driven EV Battery Pack Design And Manufacturing In The Decade Of Vehicle Electrification

Power/Performance Bits: Nov. 19

Building Powertrains To Meet EV Demand

Week in Review: IoT, Security, Autos

Week in Review: IoT, Security, Autos

System Bits: Oct. 15

Week in Review – IoT, Security, Autos

Week in Review – IoT, Security, Autos

Week in Review – IoT, Security, Autos

Week in Review – IoT, Security, Autos