Startup Funding: April 2023

By Jesse Allen - 03 May, 2023 - Comments: 0

Packaging was a hot spot in April, with one of the largest rounds going to a middle-end-of-line advanced packaging company. A second packaging company also drew significant funding for its focus on wafer-level packaging for CMOS image sensors. Two packaging substrate manufacturers also saw investment. Two photoresist makers also drew sizeable rounds. Both they and the packaging companies are... » read more

Startup Funding: February 2022

By Jesse Allen - 07 Mar, 2022 - Comments: 0

Mega-rounds dominated venture funding in February, with ten companies seeing investment of $100 million or more, five of which exceeded $200 million. Automotive was the big winner, with seven of the ten companies involved in either developing ADAS and autonomous driving, building electric vehicles, or making components to go in cars. The largest round of the month falls into that last category,... » read more

Startup Funding: February 2021

By Jesse Allen - 01 Mar, 2021 - Comments: 0

In February, several startups emerge from stealth, with one company working on AI inference architectures for the data center and another trying to make lenses thinner by patterning surfaces with tiny structures. Two new Chinese companies are trying to expand the country's semiconductor design ecosystem with GPUs and interface IP. Plus, a maker of AI chips for ADAS draws another massive round t... » read more

Startup Funding: August 2020

By Jesse Allen - 02 Sep, 2020 - Comments: 0

Semiconductor startups were hot this month, with big funding going to designers and chip analytics. In automotive, one Chinese electric vehicle company raised another large round right before its IPO, and a LiDar maker's reverse merger gave it a cash infusion and set it on its own IPO road. Plus, a growing quantum computer developer saw a funding boost. This month, we feature 17 startups that c... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Startup Funding: April 2023

Startup Funding: February 2022

Startup Funding: February 2021

Startup Funding: August 2020