Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 28 Jan, 2022 - Comments: 0

China’s regulators are agreeing to AMD’s acquisition of Xilinx with the caveat that AMD must agree not to force tie-in sales Xilinx's products with AMD products, according to Reuters. China's State Administration for Market Regulation said the companies cannot discriminate against customers using other technology. Xilinx's SEC 8-K form confirms that the two companies received clearance for ... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 17 Jul, 2020 - Comments: 0

Arm's parent company, Japanese tech conglomerate Softbank, reportedly is considering a sale or IPO of its Arm subsidiary, which it purchased in 2016 for $32 billion in cash. Considering that Arm chips are in most smart phones, as well as an increasing number of computers and IoT and edge devices, this development is being closely followed by most of the tech world. Last week, Softbank directed ... » read more

Week In Review: IoT, Security, Automotive

By Susan Rambo - 22 Nov, 2019 - Comments: 0

Automotive Porsche’s electric race car, the 99X Electric, used ANSYS Technology’s system-level simulation solutions to create an advanced electric powertrain. The powertrain is also being adapted for use in Porsche’s consumer electric cars. "ANSYS system-level simulations are instrumental for optimizing the Porsche E-Performance Powertrain's motor, gearbox, power electronics and control ... » read more

The Week In Review: Design/IoT

By Jesse Allen - 06 May, 2016 - Comments: 0

Standards The IEEE launched the International Roadmap for Devices and Systems (IRDS), effectively setting the industry agenda for future silicon benchmarking and adding metrics that are relevant to specific markets rather than creating the fastest general-purpose processing elements at the smallest process node. For more on the IRDS, check out Ed Sperling's analysis. Accellera's SystemC A... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Faraday Technology Corporation

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing

Week In Review: IoT, Security, Automotive

The Week In Review: Design/IoT

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Knowledge Centers
Entities, people and technologies explored