Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 07 Jul, 2023 - Comments: 0

Joby Aviation and Alef Automotive each received a Special Airworthiness Certificate from the U.S. Federal Aviation Administration (FAA) for an electric vertical take-off and landing (eVTOL) aircraft. Joby will now begin flight testing the prototype, and the aircraft will move to Edwards Air Force Base in 2024 as part of a contract with the U.S. Air Force. Alef’s model is the first U.S. govern... » read more

Week In Review: IoT, Automotive & Security

By Susan Rambo - 03 Jan, 2020 - Comments: 0

Internet of Things Qorvo, the company whose products sent pictures back from Pluto and Arrokoth (formerly Ultima Thule) on New Horizons, is showing off a couple smart home, IoT products at CES 2020 in Las Vegas next week. The company says its new transceiver chip QPG7015M will simplify gateway IoT design because the chip can simultaneously handle all open, smart home protocols, including ZigBe... » read more

Auto Suppliers: More Than Chips

By Jeff Dorsch - 14 Aug, 2017 - Comments: 1

The semiconductor industry is revving up its present and future contributions to advanced driver-assistance systems and autonomous driving. Those areas represent tremendous growth opportunities for chips, modules, and software going into automotive electronics. There’s also the development of artificial intelligence and machine learning applications in automotive design, which are brand new c... » read more

System Bits: July 3

By Ann Mutschler - 03 Jul, 2017 - Comments: 0

VW emissions tests cheat code found A team of researchers from UC San Diego, Ruhr University along with an independent researcher has uncovered the mechanism that Volkswagen used to circumvent U.S. and European emission tests over a period of at least six years before the EPA put the company on notice in 2015 for violating the Clean Air Act. The researchers found the code that allowed onboa... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Fiat

Week In Review: Auto, Security, Pervasive Computing

Week In Review: IoT, Automotive & Security

Auto Suppliers: More Than Chips

System Bits: July 3

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Knowledge Centers
Entities, people and technologies explored