March’19 Startup Funding: Money Springs Forth

By Jeff Dorsch - 04 Apr, 2019 - Comments: 0

Another month, another couple of billion-dollar rounds. Singapore-based Grab raised nearly $1.5 billion from the SoftBank Vision Fund, bringing its total private funding to more than $4.5 billion and valuing the company at around $14 billion. Grab has acquired Uber’s ride-hailing business in Southeast Asia and now competes chiefly with Go-Jek of Indonesia in Thailand and other emerging mar... » read more

The Week in Review: IoT

By Jeff Dorsch - 02 Mar, 2018 - Comments: 0

Finance CyberX raised $18 million in Series B funding, bringing its total funding to $30 million. Norwest Venture Partners led the new round and was joined by ff Venture Capital, Flint Capital, Glilot Capital Partners, and OurCrowd. CyberX makes its headquarters in Framingham, Mass., with operations in Israel. The startup offers security protection for Industrial Internet of Things application... » read more

The Week in Review: IoT

By Jeff Dorsch - 05 Aug, 2016 - Comments: 0

Deals Rambus finalized its acquisition of the memory interconnect business at Inphi. The closing price was $90 million in cash. The former Inphi business became part of the Memory and Interfaces Division at Rambus. CyberX raised $9 million of private funding in a financing round led by Flint Capital. Glilot Capital Partners, Swarth Group, and GlenRock, all existing investors, were joined by... » read more

Knowledge Centers
Entities, people and technologies explored

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Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

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by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Flint Capital

March’19 Startup Funding: Money Springs Forth

The Week in Review: IoT

The Week in Review: IoT

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