Week In Review: Design, Low Power

By Jesse Allen - 10 Jan, 2020 - Comments: 0

Synopsys will acquire certain IP assets of INVECAS. The acquisition expands Synopsys' DesignWare Logic Library, General Purpose I/O, Embedded Memory, Interface and Analog IP portfolio. The acquisition will also add a team of experienced R&D engineers to focus on physical IP across a range of process technologies. INVECAS will retain its HDMI IP and ASIC Design Solutions businesses. The deal... » read more

Week In Review: IoT, Security, Autos

By Susan Rambo - 10 Jan, 2020 - Comments: 0

Internet of Things Sensors that see in the dark, look deep into our faces and hear the impossible, were all part of ams’ CES lineup this week. ams announced that it has designed an advanced spectral ambient light sensor (ALS) for high-end mobile phone cameras. The ALS, called the AS7350, identifies the light source and makes an accurate white balance under low-light and other non-ideal condi... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 15 Feb, 2019 - Comments: 0

Internet of Things Is Google developing a Pixel Watch wearable? Perhaps, if recent job listings are any indication. The company recently was looking to hire someone as vice president of hardware engineering, wearables. Last month, Fossil Group sold smartwatch technology intellectual property to Google for $40 million, while Google hired certain members of Fossil’s wearables R&D team. ... » read more

The Week In Review: Aug. 19

By Mark LaPedus - 19 Aug, 2013 - Comments: 0

By Mark LaPedus Applied Materials named Gary Dickerson, who has been serving as president of the company, as CEO. Mike Splinter, who held the reins since 2003, was elevated to executive chairman of the board. Dickerson served as the CEO of Varian, which Applied acquired in 2011, as well as the president and COO of KLA-Tencor. Applied Materials also announced its Q3 results. The company rep... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: FLIR Systems

Week In Review: Design, Low Power

Week In Review: IoT, Security, Autos

Week in Review: IoT, Security, Auto

The Week In Review: Aug. 19