Next-Gen Memory Ramping Up


The next-generation memory market is heating up as vendors ramp a number of new technologies, but there are some challenges in bringing these products into the mainstream. For years, the industry has been working on a variety of memory technologies, including carbon nanotube RAM, FRAM, MRAM, phase-change memory and ReRAM. Some are shipping, while others are in R&D. Each memory type is di... » read more

Week in Review: IoT, Security, Auto


Deals SoftBank Corp. reached an agreement with Indonesia’s Link Net to work together on Internet of Things technology. Hidebumi Kitahara of SoftBank said in a statement, “The global mobile industry is now entering the 5G era, with IoT becoming the central focal point of innovation. This partnership with Link Net shows our strong commitment to further boost technology innovation in the glob... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Fujitsu Semiconductor and United Microelectronics Corp. (UMC) announced that UMC will acquire all of the shares of Mie Fujitsu Semiconductor Limited (MIFS), a 300mm wafer foundry joint venture between both companies. In addition to the 15.9% of MIFS shares currently owned by UMC, Fujitsu Semiconductor will transfer the remaining 84.1% of its shares in MIFS to UMC, making MI... » read more

Toward IIoT Security Standards


Security is a high priority within Industrial IoT projects, but it is advancing like the rest of the industry—inconsistently, with big gaps between the leaders and everyone else. That isn't unique to one or two industrial segments. It applies to all of them, and even to slices within particularly industries. "There is some confusion about security because it's not just the IT issues," s... » read more

AI And Machine Learning Drive New SoC Verification Choices


I have previously written about the choices that design teams have when choosing specific verification engines—virtual, formal, simulation, emulation, FPGA and actual silicon. As a new class of SoC is emerging for machine learning and artificial intelligence with complexities previously unheard of, they further deepen the challenge of choosing the right tool for the job. Even the choice betwe... » read more

Manufacturing Bits: Feb. 6


GaN trusted foundry HRL Laboratories--an R&D venture between Boeing and General Motors--has launched a new foundry service for use in advanced millimeter-wave (mmWave) gallium-nitride (GaN) technology applications. HRL’s process, called T3-GaN, is a high-electron-mobility transistor technology. It will enable the fabrication of GaN-based monolithic microwave integrated circuits (MMICs) fo... » read more

A New Memory Contender?


Momentum is building for a new class of ferroelectric memories that could alter the next-generation memory landscape. Generally, ferroelectrics are associated with a memory type called ferroelectric RAMs (FRAMs). Rolled out by several vendors in the late 1990s, FRAMs are low-power, nonvolatile devices, but they are also limited to niche applications and unable to scale beyond 130nm. While... » read more

The Week in Review: IoT


Products/Services At this week’s AWS re:Invent conference in Las Vegas, Nevada, Amazon Web Services introduced a number of products and services for the Internet of Things, machine learning, and other areas. These include Amazon FreeRTOS (an operating system for IoT microcontrollers), AWS IoT Device Defender (security management), AWS IoT 1-Click, AWS IoT Device Management, AWS IoT Analytics... » read more

The Week In Review: Manufacturing


Materials and equipment A scandal has rocked Japan’s Kobe Steel. The company disclosed that it has falsified inspection data for iron powder, aluminum and copper products that were sent to over 200 customers in the automotive, electronics, transportation and other sectors. The falsified data involves 20,000 tones of products, according to reports. Kobe apologized for the issues and provided ... » read more

What Happened To ReRAM?


Resistive RAM (ReRAM), one of a handful of next-generation memories under development, is finally gaining traction after years of setbacks. Fujitsu and Panasonic are jointly ramping up a second-generation ReRAM device. In addition, Crossbar is sampling a 40nm ReRAM technology, which is being made on a foundry basis by China’s SMIC. And not to be outdone, TSMC and UMC recently put ReRAM on ... » read more

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