The Week In Review: Manufacturing


Fab tools Lam Research held an analyst event this week. The company indicated that the industry is in the midst of a memory boom, including both DRAM and 3D NAND. According to Amit Daryanani, an analyst with RBC, here was one of the big takeaways at the event: “The memory spend portion of WFE is more sustainable than previously assumed due to end-market drivers such as big data, automation, ... » read more

The Week In Review: IoT


Legislation Four senators plan to introduce a bipartisan bill that would require federal government vendors to provide Internet-connected devices and equipment that is patchable and conforms to industry cybersecurity standards. Such products must not have unchangeable passwords or known security vulnerabilities. The bill was drafted with expert advice from the Atlantic Council and Harvard Univ... » read more

Chaos, Progress In Mobile Payment Security


Semiconductor suppliers and their embedded software partners, internally and externally, have made tremendous strides in recent years supporting secure mobile payment processing. It hasn't been easy. Or simple. And it's still evolving. The result of those efforts, which is now set to play an increasingly important and widespread commercial role in 2017, are trusted execution environment t... » read more

New Embedded Memories Ahead


The embedded memory market is beginning to heat up, fueled by a new wave of microcontrollers (MCUs) and related chips that will likely require new and more capable nonvolatile memory types. The industry is moving on several different fronts in the embedded memory landscape. On one front, traditional solutions are advancing. On another front, several vendors are positioning the next-generatio... » read more

The Week In Review: Design


IP ARM unveiled a suite of products focused on the IoT, with new processors, radio technology, subsystems, end-to-end security and a cloud-based services platform. Included are Cortex-M23 and Cortex-M33, the first embedded processors based on the ARMv8-M architecture. The Cortex-M33 features configuration options including a coprocessor interface, DSP and floating point computation, while th... » read more

“Eating Your Own Dog Food” When Developing An Emulator


It’s a great week for emulation week with ARM TechCon happening in Silicon Valley. Palladium Z1 is a finalist for Best Product in the categories “Best Chip” and “Best System” and we started the week with an announcement that Fujitsu adopted the Cadence Palladium Z1 Enterprise Emulation Platform for their ARMv8-based “Post-K Supercomputer Development.” Cadence has faced some of the... » read more

The Week In Review: IoT


Security The Industrial Internet Consortium this week unveiled the Industrial Internet Security Framework, a set of specifications for connected health-care devices and hospitals, intelligent transportation, smart electrical grids, smart factories, and other cyber-physical systems in the Internet of Things. AT&T, Fujitsu, Hitachi, Infineon Technologies, Intel, Microsoft, and Symantec are among... » read more

The Week in Review: IoT


Technology The Internet of Things got some attention at this week’s Intel Developer Forum in San Francisco. Intel CEO Brian Krzanich introduced the Joule compute module in his opening-day keynote address. The module is a high-performance developer platform supporting Intel RealSense depth-sensing cameras. Canonical, Microsoft, and PivotHead were among the IDF exhibitors demonstrating the Jou... » read more

Keeping The Lights On


IoT is comprised of numerous industries. For the sake of analysis, these can be segmented into several tiers that function as independent networks or integrated complicated meshes. In my November post I examined the three-tier IoT architecture at a high level. Then last month I focused on the rapidly expanding market of intelligent gateways. Gateways receive information from cloud applicatio... » read more

What Happened To GaN And SiC?


About five years ago, some chipmakers claimed that traditional silicon-based power MOSFETs had hit the wall, prompting the need for a new power transistor technology. At the time, some thought that two wide-bandgap technologies—gallium nitride (GaN) on silicon and silicon carbide (SiC) MOSFETs—would displace the ubiquitous power MOSFET. In addition, GaN and SiC were supposed to pose a t... » read more

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